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Global Market Study on Semiconductor Assembly and Testing Services (SATS): To be Driven by Increasing Demand for High-End Packaging Solutions, Persistence Market ResearchNEW YORK, Nov. 21, 2016 /PRNewswire/ -- The SATS market is anticipated to have substantial growth mainly driven by the increasing costs for advanced packaging solutions. However, with increasing competition, the price is expected to decrease in the foreseeable future. Major drivers propelling the market include: increasing demand for mobility and connectivity in consumer electronic products and increasing demand of advanced electronic systems in the automobiles Additionally, increasing demand for mobility and connectivity in the consumer electronic products and ability of SATS providers to facilitate a more efficient supply chain and reduced time-to-market are few other factors propelling the market growth. SATS providers offer additional features over in-house testing and packaging capabilities which is one of the primary factors for Integrated Device Manufacturers (IDM) to outsource the SATS services. In addition, the global market of semiconductor assembly and test services has been witnessing the emergence of strategic alliances and collaborations among the leading providers and manufacturers due to rising financial pressures. The Semiconductor Assembly and Testing Services market is segmented as follows: By Services By Application By Region On the basis of services, the SATS market is segmented into: Assembly & Packaging Services Testing Services Of these, the assembly & packaging services accounted for the highest share of the overall semiconductor assembly and testing services market in 2014. The semiconductor assembly and testing services market is mainly driven by factors such as increasing adoption of consumer electronics products such as tablet PCs and wearable devices (smart watches, head mounted devices, fitness equipment etc. in the developed economies. The section that follows analyzes the market on the basis of packaging solutions and presents the market size in terms of value for the forecast period. On the basis of packaging solutions, the SATS market is segmented as follows: Copper Wire and Gold Wire Bonding Copper Clip Flip Chip Wafer Level Packaging TSV Of the above-mentioned segments, the wafer level packaging segment is expected to increase at the highest CAGR during the forecast period. However, the copper wire and gold wire bonding segment is expected to dominate the semiconductor assembly and testing services market in terms of value, by 2021. On the basis of application the SATS market is segmented as follows: Communication Computing and Networking Consumer electronics Industrial Automotive electronics Of the aforementioned segments, the consumer electronics segment is expected to expand at the highest CAGR during the forecast period. However, the communications application segment is expected to dominate the semiconductor assembly and testing services market in terms of value, by 2021. Leading market participants are investing heavily in R&D activities in order to innovate new advanced packaging solutions that would cater to the growing demand of miniaturization and low power requirements. For instance, in May 2014, STATS chip PAC (now JCET) introduced innovative FlexLine Manufacturing line. This manufacturing line can process multiple silicon wafer diameters, and produce both fan-in and fan-out wafer level packages on it. Additionally, it pioneered the Through Silicon via (TSV) enabled 3D chip stacking technology in August 2013. The report also analyzes the market on the basis of region and presents the market size in terms of value for the forecast period. Regions covered in the report are as follows: North America Asia Pacific Excluding Taiwan China Japan Singapore, Thailand The Philippines Taiwan Europe The Middle East & Africa Latin America Of the aforementioned segments, the Taiwan market is expected to expand at the highest CAGR during the forecast period and is expected to remain largest market share, out of the total semiconductor assembly and testing services market in 2021. Read the full report: http://www.reportlinker.com/p04040036-summary/view-report.html About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place. http://www.reportlinker.com __________________________ Contact Clare: [email protected] US: (339)-368-6001 Intl: +1 339-368-6001 To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-market-study-on-semiconductor-assembly-and-testing-services-sats-to-be-driven-by-increasing-demand-for-high-end-packaging-solutions-persistence-market-research-300366841.html SOURCE Reportlinker 
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