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Global Flip Chip Market Worth USD 46 Billion by 2022 - Analysis, Technologies & Forecasts Report 2014-2022 - Vendors: IBM, 3M, TSMC - Research and Markets
[October 28, 2016]

Global Flip Chip Market Worth USD 46 Billion by 2022 - Analysis, Technologies & Forecasts Report 2014-2022 - Vendors: IBM, 3M, TSMC - Research and Markets


Research and Markets has announced the addition of the "Flip Chip Market by Packaging Technology, Bumping Technology, Industry - Global Opportunity Analysis and Industry Forecast, 2014 - 2022" report to their offering.

A new report titled, "Flip Chip Market - Global Opportunity Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by 2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global flip chip market and contributed over half of the market share owing to thriving market for semiconductors and electronic devices.

Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently, copper bumping is extensively used in market owing to its advantages such as considerably low cost than other methods, high efficiency and compatibility with bond pads. Furthermore, imending need of circuit miniaturization, thriving portable devices industry and technological superiority over wire bond connections are major factors expected to propel the growth in global flip chip market. However, availability of less customization options as well as high capital investment requirements for setting up a new plant are the limitations that restrict the market growth.



2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption.

Companies Mentioned:


  • IBM
  • Intel Corporation
  • Fujitsu (News - Alert) Ltd.
  • 3M
  • Samsung electronics Co., Ltd.
  • Amkor Technology, Inc.
  • TSMC, Ltd.
  • Apple, Inc.
  • Texas Instruments (News - Alert), Inc.
  • AMD, Inc.

Report Structure:

CHAPTER 1 Introduction

CHAPTER 2 EXECUTIVE SUMMARY

CHAPTER 3 MARKET OVERVIEW

CHAPTER 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

CHAPTER 5 WORLD FLIP CHIP MARKET, BY INDUSTRY

CHAPTER 6 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

CHAPTER 7 WORLD FLIP CHIP MARKET BY GEOGRAPHY

CHAPTER 8 COMPANY PROFILES

For more information about this report visit http://www.researchandmarkets.com/research/dhr7mc/flip_chip_market


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