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Rudolph Technologies to Participate in the Eighth Annual CEO Investor Summit 2016Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, will be participating in the Eighth Annual CEO Investor Summit 2016, Wednesday July 13, 2016 in San Francisco, California.
Eighth Annual CEO Investor Summit - July 13, 2016 (San Francisco, CA (News - Alert)) The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON West and Intersolar 2016 in San Francisco. The event is hosted by executive management from participating companies and will feature a "round-robin" format consisting of small group meetings, each 30 minutes in duration. The 20 management teams collectively hosting the 2016 CEO Summit include: Axcelis (ACLS), Aehr Test (AEHR), Brooks (BRKS), Camtek (CAMT), Cabot Micro (CCMP), Cohu (COHU), Electro Scientific (ESIO), Exar (News - Alert) (EXAR), FormFactor (FORM), inTEST (INTT), Intevac (IVAC), MKS Instruments (MKSI), Nanometrics (NANO), Rudolph (RTEC), Soitec (SOIT), Tessera (TSRA), Tower (TSEM), Ultra Clean (UCTT), Ultratech (News - Alert) (UTEK) and Xcerra (XCRA). Sponsors of the event include Cowen & Co and Stifel. The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is July 6, 2016. While held concurrently with SEMICON West and Intersolar 2016, the event is not affiliated with the show. To RSVP for the CEO Summit, please contact either of the Summit's co-chairs.
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