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Microsemi's High Security, High Reliability IGLOO2 FPGAs Achieve AEC-Q100 Grade 1 Specification for Automotive ApplicationsALISO VIEJO, Calif., Jan. 7, 2016 /PRNewswire/ -- Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced qualification of its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs). In addition to outlining the criterion for electronic components to ensure that end systems meet automotive reliability levels, the grade 1 industry standard specification validates Microsemi's IGLOO™2 FPGAs as offering the highest junction temperature in its class?up to an impressive 125 degrees ambient (135 degrees Celsius junction). "Our automotive-grade FPGAs offer the highest reliability and security in critical under-the-hood applications to ensure the safety of our customers' design, data and hardware," said Bruce Weyer, vice president and business unit manager at Microsemi. "In addition to providing the highest operating temperature, the IGLOO2 AEC-Q100 grade 1 FPGAs also provide the lowest total power in their class, enabling automotive designers to maximize their dynamic power budget in compact and high performance systems to deliver highly differentiated automotive solutions at the lowest total cost of ownership." Microsemi's IGLOO2 FPGA devices, which also met industry standard specifications for grade 2 temperature range earlier this year along with Microsemi's SmartFusion2 system-on-chip (SoC) FPGAs, offer customers single event upset (SEU) immunity from neutron-induced firm errors, helping them achieve the zero defect rate essential for the automotive industry, as well as the company's award-winning security features and secure supply chain. These features address the most important design concerns for today's automotive designers. Microsemi's newly qualified devices are also the most suitable alternate to ASICs providing a low power, cost-effective, secure and reliable solution for automotive applications including advanced driver assistance systems (ADAS), vehicle-to-vehicle/vehicle-to-everything (V2V/V2X) communication and electric/hybrid engine control units. Demand for high reliability in critical applications, ensuring zero-defect and tamper-free applications, continues to grow rapidly in the automotive industry. With an increase in security mandates amongst its customer base, Microsemi is the only vendor offering automotive-grade FPGAs at higher junction temperature, along with best-in-class security in low power and small footprint packages. "The automotive market for semiconductors is forecast to grow to $32.3 billion in 2016, from $30.3 billion in 2015, an increase of almost 7 percent," commented Colin Barnden, principal analyst at Semicast Research. "In comparison, we see the market for semiconductors in vehicle connectivity and ADAS growing at more than 20 percent in 2016. Microsemi's SmartFusion2 and IGLOO2 devices bring world class securty features to the automotive industry and will address several challenges such as hacking, malicious tampering and data theft faced by system designers in creating safe and secure systems for the connected automobiles of the future." Product Demonstrations in Booth W2-78 at CAR-ELE JAPAN Availability About Microsemi's IGLOO2 FPGAs About Microsemi's Product Portfolio for Automotive Applications About Microsemi Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners. "Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its AEC-Q100 grade 1 automotive-grade field programmable gate arrays (FPGAs), and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances. Logo - http://photos.prnewswire.com/prnh/20110909/MM66070LOGO
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