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Reverse Costing Analysis of Samsung's Galaxy S6 Fingerprint Sensor

[October 09, 2015]

Reverse Costing Analysis of Samsung's Galaxy S6 Fingerprint Sensor

DUBLIN, Oct. 09 2015 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/6g9l3b/samsung_galaxy_s6) has announced the addition of the "Samsung Galaxy S6 Fingerprint Sensor - Reverse Costing Analysis" report to their offering.

For the second time Samsung introduces in its products a fingerprint sensor based on PCB capacitive technology, but with significant innovations.

Samsung's technological choice for the second fingerprint sensor is to continue using Synaptics' PCB technology but modify totally the capacitive sensing technology, increasing the processing capability of the CMOS and innovative method to detect the presence of an object.

Unlike the Galaxy S5' fingerprint, it does not require anymore to swipe the finger to get thefinger image.

Located above the home button, the sensor is incorporated within a rectangular shaped housing composed of an aluminum ring and an aluminum base. The sensor is protected by a white plastic cover and supported by innovative assembly of rigid and flex PCB.

The report includes comparisons between Galaxy S5 fingerprint sensor and the latest Apple's and Huawei's fingerprints buttons.

Key Topics Covered:

1. Overview / Introduction

2. Synaptics/Samsung Company Profile

3. Physical Analysis

4. Physical Analysis Methodology
- Fingerprint Button assembly
- Package View & Dimensions
- Package Opening
- Package Cross-Section
- Sensing PCB
- Dimensions & Markings
- Delayering
- PCB Process
- PCB Cross-Section
- ASIC Die
- Dimensions & Markings
- Delayering
- IC Process
- Die Cross-Section
- Bottom PCB
- Dimensions & Markings
- Delayering
- PCB Process
- PCB Cross-Section

5. Manufacturing Process Flow

6. Global Overview
- IC Front-End Process
- IC Fabrication Unit
- PCB fabrication Unit
- Packaging Process Flow

7. Cost Analysis

8. Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- Back-End 0 : Probe Test & Dicing
- Wafer & Die Cost
- Sensing PCB Cost
- Back-End: Packaging Cost
- Back-End: Final Test Cost
- Component Cost & Price

For more information visit http://www.researchandmarkets.com/research/6g9l3b/samsung_galaxy_s6

Media Contact: Laura Wood , +353-1-481-1716, [email protected]

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/reverse-costing-analysis-of-samsungs-galaxy-s6-fingerprint-sensor-300157221.html

SOURCE Research and Markets

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