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Technavio Confirms Evolution of LTE 4G Will Boost the Global Organic Substrate Packaging Material Market Through 2019Technavio has published a new report on the global organic substrate packaging material market, which is expected to grow at a CAGR of over 5% from 2015-2019. About the Report According to the new report by Technavio, LTE (News - Alert) 4G network requires base station system on chip (SoC), which uses IC substrate chips as the base on which the circuit is constructed. Moreover, SoC has low manufacturing costs because of the presence of fewer packages than multichip systems. "The use of SoC in LTE network is increasing the demand for IC substrate chips, thereby driving market growth," says Faisal Ghaus, Vice President of Technavio. The latest report by Technavio also emphasizes the growing demand for system integration, cost benefits, and complete system configuration, which will propel the growth of system in package (SiP). "SiP dies can be stacked either vertically or horizontally, and they are connected to bonding wires and solder bumps. Apart from multiple ICs of different functionalities, it can contain passive components such as MEMS, mechanical parts, filters, and connectors in a single package," adds Ghaus. Market Scope and Calculation of Market Size The new Technavio report coves the present scenario and growth prospects of the global organic substrate packaging material market from 2015-2019. The report provides the ranking of the leading vendors in the market based on the revenue generated by the products in the different segments of the market. Key Information Covered in the Report:
Technavio currently has more than 3000 market research reports on a huge range of topics, including 200+ reports on the packaging market: If you are interested in more information, please contact our media team at [email protected].
View source version on businesswire.com: http://www.businesswire.com/news/home/20150916005529/en/ |
