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Global Interconnect Market 2015-2019NEW YORK, Sept. 7, 2015 /PRNewswire/ -- About Interconnect Device Technavio's analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019. Covered in this Report Technavio's report, Global Interconnect Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years. The report includes a discussion of the key vendors operting in this market. Key Regions - APAC - Europe - North America Key Vendors - Amphenol - Foxconn - Molex - TE Connectivity - Yazaki Other Prominent Vendors - 3M - Alstom SA - Belden Incorporated - Delphi - JST - Phoenix Contact - Rosenberger - Sumitomo Wiring Systems Key Market Driver - Increasing Demand for Bandwidth - For a full, detailed list, view our report Key Market Challenge - Absence of Uniform Standard - For a full, detailed list, view our report Key Market Trend - Real-time Data for Industrial Applications - For a full, detailed list, view our report Key Questions Answered in this Report - What will the market size be in 2019 and what will the growth rate be? - What are the key market trends? - What is driving this market? - What are the challenges to market growth? - Who are the key vendors in this market space? - What are the market opportunities and threats faced by the key vendors? - What are the strengths and weaknesses of the key vendors? Read the full report: http://www.reportlinker.com/p03170215-summary/view-report.html About Reportlinker Report Contact Clare: [email protected] To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-interconnect-market-2015-2019-300138703.html SOURCE Reportlinker |