[June 22, 2015]

Research and Markets: Huawei Ascend Mate 7 Fingerprint Sensor - Reverse Costing Analysis

Research and Markets (http://www.researchandmarkets.com/research/6444hh/huawei_ascend) has announced the addition of the "Huawei Ascend Mate 7 Fingerprint Sensor - Reverse Costing Analysis" report to their offering.

Huawei's technological choice for the fingerprint sensor is going the opposite direction than Apple's and Samsung's (News - Alert). The Ascend Mate 7 presents an innovative fingerprint sensor developed by Fingerprint Cards, a main actor in capacitive sensing human interface solutions for consumer electronics companies.

The technical choice of Fingerprint Cards is totally different from the others'. The fingerprint device is much bigger and more expensive than its competitors (2.5 factor) to guarantee a better image quality. It presents a new sensing device design and structure, innovative packaging and a different supply chain model.

The fingerprint sensor of the Ascend Mate 7 is located on the back side of the telephone and it has the dimension of 16.33×15.8 mm. The sensor is assembled on LGA packaging and ncorporated within a rectangular-shaped housing composed of an aluminum ring and plastic ring.

The report presents a detailed analysis of fingerprint structure and cost and a comparison with Apple's (News - Alert) iPhone5 and Samsung's Galaxy S5 fingerprint sensors.

Key Topics Covered:

1. Glossary

2. Overview/Introduction

3. Executive Summary

- Reverse Costing Methodology

4. Company Profile

5. Fingerprint Cards

6. Physical Analysis

7. Synthesis of the Physical Analysis

- Ascend Mate 7 Fingerprint disassembly

- Fingerprint Sensor Views

- Fingerprint Sensor Cross-Section

- Fingerprint Sensor Patents

- ASIC Die View & Dimensions

- ASIC Die marking

- ASIC Die Capacitors

- ASIC Die Edge Contact

- ASIC Delayering & Main Blocks

- ASIC Die Process

- ASIC Die Cross-Section

- ASIC Die Process Characteristic

8. Sensor Manufacturing Process

9. ASIC Front-End Process

- ASIC Front-End Wafer Fabrication Unit

- Packaging Process

- Packaging Fabrication Unit

- Synthesis of the main parts

10. Cost Analysis

11. Synthesis of the cost analysis

- Main steps of economic analysis

- Yields Explanation

- Yields Hypotheses

- ASIC Wafer Cost

- ASIC Die Cost

12. LGA Packaged Component

13. LGA Packaging Cost

- Components Cost

14. Fingerprint Module Cost

15. Components Cost

- Fingerprint Sensor Assembly Cost

16. Huawei's (News - Alert) vs Samsung's vs Apple's fingerprint sensor

For more information visit http://www.researchandmarkets.com/research/6444hh/huawei_ascend.

View source version on businesswire.com: http://www.businesswire.com/news/home/20150622006286/en/

[ Back To TMCnet.com's Homepage ]