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MEDIA ALERT: X-FAB to Exhibit, Introduce its Support for Cadence Digital Signoff Solutions, and Present at CDNLive EMEA 2015X-FAB Silicon Foundries:
Who
What Joerg Doblaski, X-FAB's Director for Design Support, and Thomas Ramsch, Director NVM Development, will be on hand in the Designer Expo area to discuss X-FAB's recent advancements, including qualification and support for the Cadence Tempus™ Timing Signoff Solution and Cadence Voltus™ IC Power Integrity Solution; these solutions are fully compatible with all X-FAB process technologies and existing process design kits, and no re-characterization is needed. In addition, Melanie Wilhelm, Design Support Engineer, will present a paper, "Closing Gaps in Mixed-Signal Power Implementation Using a Consistent Power Aware (News - Alert) CPF Workflow." It introduces the analog-on-top design flow with Common Power Format, and explains how X-FAB supports its fast and easy adoption. CDNLive EMEA brings together a record number of Cadence technology users, developers, and industry experts to network, share best practices on critical design and verification issues and discover new techniques for designing advanced silicon, SoCs and systems.
When/Where
Presentation (Mixed-Signal Track):
Dolce Hotel Unterschleissheim About X-FAB X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt, Dresden and Itzehohe (Germany); Lubbock, Texas (U.S.); and Kuching, Sarawak (Malaysia); and employs approximately 2,500 people worldwide. Wafers are manufactured based on advanced modular CMOS, BiCMOS and MEMS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com. Acronyms
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