| [November 17, 2014] |
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Rudolph Gains Traction in Mobile Device Market with Multi-System Orders for Its MetaPULSE G Metrology System
FLANDERS, N.J. --(Business Wire)--
Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has
received multi-system orders from several customers for its latest
MetaPULSE® G metal
metrology system in support of their mobile device components ramp.
The MetaPULSE systems will provide critical process control metrology
enabling the manufacture of advanced multi-band and multi-mode frequency
components used in the latest generation of smartphones and mobile
devices. The MetaPULSE G system is the most capable metrology tool for
measuring multilayer films simultaneously within a device.
"Consumer demand for more power and higher functionality from handheld
devices and the burgeoning Internet of Things (IoT) are driving
continued technological innovation in the mobile and connected device
markets. As a result, we see tremendous growth in specialty components
such as MEMS sensors, frequency filters and power devices supporting the
mobile and wireless IC market," states Tim Kryman, director of metrology
product management. "Many of these critical components are being
manufactured using 200mm legacy infrastructure accompanied by newly
developed processes and expanded capacity to support the continued
market growth. Rudolph's metrology systems are uniquely positioned to
take advantage of this growth."
Kryman adds, "We are pleased that MetaPULSE G systems are being adopted
for the process control of critical devices driving growth in expanding
mobility and IoT markets. Not only are we providing advanced process
control metrology to our customers, but we also deliver wafer handling
solutions tailored to the smaller substrate sizes used for these
devices."
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Rudolph's MetaPULSE system uses a laser-induced ultrasonic sonar pulse
to characterize thickness, density and other parameters of single layers
or multi layered stacks of opaque materials, non-destructively and
without interference from underlying layers. The MetaPULSE G system
delivers superior performance on metal films, and is optimized for thin
single and multilayer applications that are critical in advanced logic,
memory and 3D packaging processes. Unlike optical and x-ray techniques,
PULSE™ Technology can be used in active die without special test pads.
Its 10x10 micron spot size assures measurement capability on product
wafers in 15x15 micron test sites.
For more information about Rudolph's MetaPULSE G System, please visit www.rudolphtech.com.
About Rudolph Technologies
Rudolph Technologies, Inc. is a
worldwide leader in the design, development, manufacture and support of
defect inspection, advanced packaging lithography, process control
metrology, and data analysis systems and software used by semiconductor
device manufacturers worldwide. Rudolph provides a full-fab solution
through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device
manufacturers to drive down the costs and time to market of their
products. The Company's expanding portfolio of equipment and software
solutions is used in both the wafer processing and final manufacturing
of ICs, and in adjacent markets such as FPD, LED and Solar.
Headquartered in Flanders, New Jersey, Rudolph supports its customers
with a worldwide sales and service organization. Additional information
can be found on the Company's website at www.rudolphtech.com.
Safe Harbor Statement
This press release contains
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995 (the "Act") which include the benefits to
customers of Rudolph's products, Rudolph's business momentum and future
growth, Rudolph's existing market position and its ability to maintain
and advance such position relative to its competitors and Rudolph's
ability to meet the expectations and needs of our customers as well as
other matters that are not purely historical data. Rudolph wishes to
take advantage of the "safe harbor" provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph's control. Such factors include, but are not
limited to, delays in shipping products for technical performance,
component supply or other reasons, the company's ability to leverage its
resources to improve its positions in its core markets and fluctuations
in customer capital spending. Additional information and considerations
regarding the risks faced by Rudolph are available in Rudolph's Form
10-K report for the year ended December 31, 2013 and other filings with
the Securities and Exchange Commission. As the forward-looking
statements are based on Rudolph's current expectations, the company
cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to
update the forward-looking information contained in this press release.
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