TMCnet News
Research and Markets: Global 3D IC Market Outlook 2018 Featuring Advanced Semiconductor Engineering, Samsung Electronics, STMicroelectronics & Taiwan Semiconductor ManufacturingDUBLIN --(Business Wire)-- Research and Markets (http://www.researchandmarkets.com/research/mrc834/global_3d_ic) has announced the addition of the "Global 3D IC Market 2014-2018" report to their offering. The Global 3D IC market to grow at a CAGR of 18.4% over the period 2013-2018 A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMSsystems. One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs. According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size. Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products. Key Vendors
Other Prominent Vendors Key Topics Covered:
For more information visit http://www.researchandmarkets.com/research/mrc834/global_3d_ic |
