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Semiconductor & IC Packaging Materials Market worth $26 Billion by 2019 - Report by MarketsandMarkets(PR Web Via Acquire Media NewsEdge) (PRWEB) September 19, 2014 The report defines and segments the "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019", with an analysis and forecast of revenues of types such as organic substrates, bonding wires, leadframes, encapsulation resins, and so on) individually. Along with this, the revenue of materials by types such as packaging technologies, and geography are also discussed. Browse 70 market data Tables and 32 Figures spread through 183 Pages and in-depth TOC on "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019". http://www.marketsandmarkets.com/Market-Reports/semiconductor-ic-packaging-materials-market-31363123.html Early buyers will receive 10% customization on reports. It also identifies the driving and restraining factors for the semiconductor and IC packaging materials market with an analysis of trends, opportunities, burning issues, and winning imperatives. The market is segmented and the revenue has been forecasted on the basis of major regions such as North America, Asia-Pacific, Europe, and Rest of the World (ROW). Furthermore, the market is segmented and revenues are forecasted on the basis of major packaging technologies of semiconductor and IC packaging materials in various electronic components such as consumer electronics, flat panel displays, and others. Speak to Analyst: http://www.marketsandmarkets.com/speaktoanalyst.asp?id=31363123 Semiconductors & IC - Major market for packaging materials The semiconductor and IC packaging materials market is segmented into following types: organic substrates, bonding wires, lead frames, encapsulation resins, and others. Each type of semiconductor and IC packaging material has its own properties and applications. These individual packaging materials have application-specific demands that are differentiated by placement, cost, and efficiency. Organic substrates are used as base materials in semiconductor applications and manufacturing. Encapsulation resins are comparatively the latest and are especially designed to protect and insulate electronic components from external threats. The use of these semiconductor and IC packaging materials increases the efficiency of their applications. Purchase Report Today! http://www.marketsandmarkets.com/Purchase/purchase_report1.asp?id=31363123 Scope of the Report By Type: 1. Organic substrates 2. Bonding wires 3. Leadframes 4. Encapsulation resins 5. Ceramic packages 6. Die attach materials 7. Thermal interface materials 8. Solder balls 9. Others By Packaging Technology: 1. SOP 2. GA 3. QFN 4. DFN 5. QFP 6. DIP 7. Others By Region: 1. Asia-Pacific 2. North America 3. Europe 4. ROW The semiconductor & IC packaging materials market to reach $26 million by 2019 The market for semiconductor and IC packaging materials in terms of revenue is expected to reach $26 million by 2019, growing at a CAGR of 4.5% from 2014 to 2019. Asia-Pacific dominated the semiconductor and IC packaging materials market revenues in 2013. Asia-Pacific is expected to remain the major by 2019, growing at a CAGR of 5.0% from 2014 to 2019. ROW is expected to be the fastest growing markets, growing at a CAGR of 3.5% from 2014 to 2019. Europe and North America are estimated to grow at a slower CAGR of 3.0% and 3.2% respectively from 2014 to 2019, owing to the rising consumption in the Asia-Pacific region, where end-user markets of semiconductor and IC packaging materials are growing steadily. Asia-Pacific alone accounted for more than 68% of the semiconductor & IC packaging materials revenues in 2013 Asia-Pacific is the largest semiconductor and IC packaging market, with major developments in China, Japan, Taiwan, and South Korea. Asia-Pacific alone accounted for 68% of the semiconductor and IC packaging materials revenue in 2013. This region is expected to dominate the market by 2019, with advanced technological developments in electronic packaging materials for end-users. Asia-Pacific is expected to remain the major semiconductor and IC packaging market by 2019, with high investments in emerging applications due to growing population and demand. You can Request for Customization here: http://www.marketsandmarkets.com/requestCustomization.asp?id=31363123 Browse Related Reports: Electronic Chemicals & Materials Market by Types (Silicon Wafer, PCB Laminate, Photoresist, Specialty Gases, etc.), APPLICATIONS (Semiconductor & IC, PCB), FORMS (Solid, Liquid, Gaseous) & GEOGRAPHY - Global Trends & Forecast to 2019 http://www.marketsandmarkets.com/Market-Reports/electronic-chemicals-market-107930161.html Global Specialty Chemicals Market by Product Type, Functional Type, Key Applications, Raw Materials, Regulations, Geography, Price Trends & Forecasts (2011 - 2016) http://www.marketsandmarkets.com/Market-Reports/global-specialty-chemicals-165.html About MarketsandMarkets MarketsandMarkets is a global market research and consulting company based in the U.S. We publish strategically analyzed market research reports and serve as a business intelligence partner to Fortune 500 companies across the world. MarketsandMarkets also provides multi-client reports, company profiles, databases, and custom research services. MarketsandMarkets covers thirteen industry verticals; including advanced materials, automotives and transportation, banking and financial services, biotechnology, chemicals, consumer goods, telecommunications and IT, energy and power, food and beverages, industrial automation, medical devices, pharmaceuticals, semiconductor and electronics, aerospace & defense. We at MarketsandMarkets are inspired to help our clients grow by providing apt business insight with our huge market intelligence repository. Contact: Mr. Rohan North - Dominion Plaza 17304 Preston Road Suite 800, Dallas, TX 75252 Tel: +1-888-600-6441 Email: [email protected] Visit MarketsandMarkets Blog @ http://www.marketsandmarketsblog.com/market-reports/chemical Read the full story at http://www.prweb.com/releases/semiconductor-ic/packagingmaterials-market/prweb12165457.htm (c) 2014 PRWEB.COM Newswire |