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Amkor Technology Assigned Patent
[August 06, 2014]

Amkor Technology Assigned Patent


(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Aug. 6 -- Amkor Technology, Chandler, Arizona, has been assigned a patent (8,796,072) developed by Michael G. Kelly, Queen Creek, Arizona, Ronald Patrick Huemoeller, Gilbert, Arizona, and Won Chul Do, Bucheon-Si, South Korea, for a "method and system for a semiconductor device package with a die-to-die first bond." The patent application was filed on Nov. 15, 2012 (13/678,012). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,796,072.PN.&OS=PN/8,796,072&RS=PN/8,796,072 Written by Kusum Sangma; edited by Jaya Anand.



KS0806JA0806-1044091 (c) 2014 Targeted News Service

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