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Global Permanent Wafer Bonding for Semiconductor Report: Trends & Technology 2014
[July 14, 2014]

Global Permanent Wafer Bonding for Semiconductor Report: Trends & Technology 2014

(GlobeNewswire Via Acquire Media NewsEdge) Dublin, July 14, 2014 (GLOBE NEWSWIRE) -- Research and Markets ( has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering. This report provides an in-depth competitive analysis of key permanent bonding equipment suppliers, with profiles of the main equipment vendors, and their future in the permanent bonding market.Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV), LED devices, and SOI substrate applications. This type of application is quite complex due to the high diversity of existing bonding technologies.Permanent bonding is today being applied in: A large quantity of MEMS devices supported by glass frit and anodic bonding technologies in order to achieve good hermeticity to protect the MEMS sensor.LED devices requiring metal bonding (eutectic and thermo-compression bonding) so as to meet higher performance in terms of light extraction.CMOS Image Sensors:BSI CMOS Image Sensor where one bonding step is required at the Front-End partCIS capping WLP to bond the glass cap wafer to the deviceSOI substrate manufacturing supporting the fusion bonding technology.These have been the 4 main leading applications for permanent bonding for several years. Permanent Bonding processes are increasingly more importance within the Semiconductor industry.Total permanent bonding market generated almost 5 Million wafers bonded in 8-inch eq, mostly driven by the established applications - BSI CIS and MEMS devices - and is expected to peak at more than 16 Million wafers bonded in 8-inch eq in 2019. The demand for permanent bonding is growing and mainly driven by the miniaturization required for 3D Stack TSV applications.Objectives of the report are to provide: Market data on key permanent bonding technologies market metrics & dynamicsKey technical insight into future permanent bonding technology trends and challengesA review of technical characteristics and challenges for each existing permanent bonding processAn overview of the technological trends and applications that use permanent bonding processesA forecast for the next five years, and predict future trends for permanent bondingForecast 2013-2019 in number of wafers, number of chambers, value in $M by application, and by permanent bonding technology Key Topics Covered: Table of contents Objectives of the studyDefinition, limitations & methodology 2011 vs. 2014 analysis comparison Companies cited in the reportGlossary Executive summary Introduction, definitions & scope of the report2013-2019 detailed permanent bonding Permanent bonding technologies 2013-2019 detailed permanent bonding forecast by applications Conclusions & perspectives Company presentation Companies Mentioned: AMDAMLApplied MaterialsAvagoBoschDisceraEVGInfineonInvenSenseLemoptixLuxteraMitsubishi Heavy IndustriesMurata / VTINemotekOSRAMPlanOptikSamsungSensonorSilicon LabsSOITECSTMicroelectronicsSUSS MicroTecSonyTeledyne DALSATokyo ElectronZiptronixIMECLetiTexas InstrumentsTezzaronWiSpryZiptronix For more information visit CONTACT: Research and Markets Laura Wood, Senior Manager For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 Sector: Semiconductor Source: Research and Markets 2014 GlobeNewswire, Inc.

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