[May 26, 2014]

Research and Markets: Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market

Research and Markets (http://www.researchandmarkets.com/research/qfw455/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering.

EV GROUP IS LEADING, AMAT AND TEL ARE MERGING, WHAT WILL HAPPEN NEXT?

The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron).

These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV.

Key Findings

• EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials (News - Alert)),two of the largest semiconductor equipment suppliers in the world.
• The entrance of aggressive new players is likely to challenge established players in the permanent bonding market:
• Some players have recently entered the marke with low barriers of entry such as Mitsubishi (News - Alert) Heavy Industry (MHI); mainly with customers involved in the R&D sector.
• Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area.
• TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature.

• Permanent bonding market metrics (wpsy, units and value)
• Breakdown by wafer size
• Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors
• Market share of each major equipment supplier
• Overview of the different permanent bonding technologies
• Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges
• Detailed analysis on the applications using permanent bonding technologies
• Detailed information on established and emerging permanent bonding process steps

Key Topics Covered:

1. Executive summary
2. Introduction, definitions & scope of the report
3. 2013-2019 detailed permanent bonding
4. Permanent bonding technologies
5. 2013-2019 detailed permanent bonding forecast by applications
6. Conclusions & perspectives
7. Company presentation

Companies Mentioned

• AMD (News - Alert)
• AML
• Applied Materials
• Avago
• Bosch
• Discera
• EVG
• Infineon
• InvenSense
• Lemoptix
• Luxtera
• Mitsubishi Heavy Industries
• Murata / VTI
• Nemotek
• OSRAM
• PlanOptik
• Samsung
• Sensonor
• Silicon Labs
• SOITEC
• STMicroelectronics (News - Alert)
• SUSS MicroTec
• Sony
• Teledyne DALSA
• Tokyo Electron
• Ziptronix
• IMEC
• Leti
• Texas Instruments (News - Alert)
• Tezzaron

For more information visit http://www.researchandmarkets.com/research/qfw455/permanent_wafer

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