|[April 28, 2014]
Research and Markets: Global Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials, Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating
DUBLIN --(Business Wire)--
Research and Markets (http://www.researchandmarkets.com/research/s9zs8w/global)
has announced the addition of the "Global
Wafer-level Packaging Equipment Market 2014-2018 with Applied Materials,
Disco, EV Group, Tokyo Electron & Tokyo Seimitsu Dominating"
report to their offering.
The Global Wafer-level Packaging Equipment market to grow at a CAGR of
2.9% over the period 2013-2018.
The most important driver is the increasing adoption of mobile devices.
Over the past decade there has been an unprecedented growth in the
adoption of mobile devices such as cell phones, smartphones, notebook
PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise
in the demand for wafer-level packaging equipment, as it is vital for
the functioning of mobile devices.
To sustain the competition in the market, semiconductor manufacturers
are continuously introducing innovative products, reducing manufacturing
costs, and improving product efficiency.For instance, they have
introduced chips that are available in smaller sizes; the sizes of these
chips have reduced from 45 nanometers to 22 nanometers. They have also
introduced chips with high dielectric constant materials and fin-fet or
tri-gate transistors. In addition, DRAM memory manufacturers are
currently employing 3x node production technology and 2x node production
technology for the production of DRAMs. As these innovations require
highly complicated wafer-level packaging equipment, the increase in the
number of innovations by semiconductor manufacturers is likely to foster
their demand in the market.
Further, the report states that one of the key challenges in this market
is the cyclical nature of the Semiconductor industry, which leads to
fluctuations in the demand for wafer-level packaging equipment.
Moreover, in some cases, the production of such equipment tends to
exceed their demand, leading to a large demand-supply gap.
Key vendors dominating this space are:
Applied Materials (News - Alert) Inc.
Tokyo Electron Ltd.
Tokyo Seimitsu Co. Ltd.
Other vendors mentioned in the report are:
Rudolph Technologies Inc
SEMES Co. Ltd
Suss Microtec AG
Ultratech (News - Alert) Inc.
Key Topics Covered:
List of Abbreviations
Scope of the Report
Market Research Methodology
Key Leading Countries
Market Growth Drivers
Drivers and their Impact
Impact of Drivers and Challenges
Trends and their Impact
Key Vendor Analysis
For more information visit http://www.researchandmarkets.com/research/s9zs8w/global
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