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Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs
[April 22, 2014]

Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs


(ENP Newswire Via Acquire Media NewsEdge) ENP Newswire - 22 April 2014 Release date- 21042014 - San Jose, Calif. And Hsinchu, Taiwan, R.O.C.- Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20nm Arria 10 FPGAs and SoCs.



Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera's 20nm device family.

'TSMC has provided a very advanced and robust integrated package solution for our Arria 10 devices, the highest-density monolithic 20nm FPGA die in the industry,' said Bill Mazotti, vice president of worldwide operations and engineering at Altera. 'Leveraging this technology is a great complement to Arria 10 FPGAs and SoCs and helps us address the packaging challenges at the 20nm node.' TSMC's leading-edge flip chip BGA package technology provides Arria 10 devices with better quality and reliability than standard copper bumping solutions through the use of fine-pitch copper bumps. The technology is able to accommodate very high bump counts as required by high-performance FPGA products. It also provides excellent bump joint fatigue life, improved performance in electro-migration current and low stress on the ELK (Extra Low-K) layers, all highly critical features for products employing advanced silicon technologies.


'TSMC's copper bump-based package technology provides excellent value for small bump pitch ( (c) 2014 Electronic News Publishing -

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