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OFC 2014 Exhibitor Profiles
[March 10, 2014]

OFC 2014 Exhibitor Profiles


SAN FRANCISCO --(Business Wire)--

OFC 2014 takes place March 9 through March 13, 2014 at the Moscone Convention Center in San Francisco.

Links to Important Information:

OFC 2014 Exhibitor News:
http://www.tradeshownews.com/events/OFC-2014/

Follow OFC Conference on twitter (official hashtag is #OFC2014):
https://twitter.com/ofcconference

Exhibit Hall Hours:
Tuesday, 11 March, 10:00 - 17:00
Wednesday, 12 March, 10:00 - 17:00
Thursday, 13 March, 10:00 - 16:00





Company: CAILabs
Booth: 2622
Web: www.cailabs.com
CAILabs is a French venture-backed optics start-up founded in 2013 by three PhDs in physics, Jean-François Morizur, Guillaume Labroille and Nicolas Treps. At the core of CAILabs lies a new technique to manipulate the spatial shape of light, first developed for quantum optics purpose at the Laboratoire Kastler Brossel in Paris (Nobel (News - Alert) Prize in physics in 2012). Using this technology, CAILabs aims at solving light shaping problems, in fields such as spatial multiplexing for telecommunications and industrial laser processes, by providing efficient and flexible light converters.
 
Company: Effdon Networks Ltd
Booth: 4651
Web: www.effdon.com
At OFC2014 booth 4651, Effdon presents a new powerful 100G transceiver products:
 
•100G CFP extended reach for 40km and 80km
•100G CFP4
•100G QSFP28
•100G CFP modules for 40km and 80km
 
The new Extended Reach 100G modules extend the distance of existing 100G cards from few meters to 80km without the need for any additional external equipment, saving operator cost by 10:1.
 
•CFP4/QSFP 100G modules
 
The new modules enable to deliver 100G services in 1/4th of the size and 1/4th of the power consumption compared to legacy 100G solutions, while reaching long range (LR) distances of up to 10kms.
 
Company: ESTERLINE SOURIAU
Booth: 2522
Web: www.souriau.com
SOURIAU designs, manufactures and markets high performance - high reliability interconnect solutions for severe environments dedicated to the Aerospace, Defense / Space, Heavy Industry (Railway & Mass Transit, Nuclear, Oil & Gas) and Industrial Equipment markets. SOURIAU has a worldwide presence with R & D centers and production sites in Europe, USA, Japan and India. The Company is deeply involved in the environmental protection with industrial sites following ISO 14001 and RoHS products. SOURIAU is now the Connection Technologies platform of Esterline Group.
 
Company: Luna
Booth: 623
Ticker Symbol & Exchange: LUNA
Web: www.lunainc.com
Every day at Luna we challenge convention.
 
We are scientists, engineers and business professionals; researching, developing and commercializing innovative technologies for the telecommunications, aerospace, automotive, energy, and defense industries.
 
Our innovation begins with excellence in research and develops into technologies that can be effectively commercialized. Our products provide all-parameter analysis of optical component and sub-assemblies allowing manufacturers and suppliers to reduce costs and time-to-market by improving component characterization and production schedules.
 
Our technologies are recognized as leaders in transforming science into solutions:
 
-Fiber-optic testing instrumentation for telecommunications
-Strain and temperature sensing solutions for composite materials, structures and systems
 
Company: MACOM (M/A-COM Technology Solutions (News - Alert))
Booth: 2203
Ticker Symbol & Exchange: MTSI
Web: www.macomtech.com
MACOM is a leading supplier of high performance analog RF, microwave, and millimeter wave products that enable next-generation Internet and modern battlefield applications. Recognized for its broad catalog portfolio of technologies and products, MACOM serves diverse markets, including high speed optical, satellite, radar, wired & wireless networks, CATV, automotive, industrial, medical, and mobile devices. A pillar of the semiconductor industry, we thrive on more than 60 years of solving our customers' most complex problems, serving as a true partner for applications ranging from RF to Light.
 
Company: Molex Incorporated
Booth: 3863
Web: www.molex.com
A leader in innovative optical and electrical interconnect solutions for high-speed, high-density, high-signal integrity applications, the Molex booth features the QSFP+™ and zQSFP+™ AOC systems, iPass+™ HD high density AOCs, Impel™ 25 Gbps backplane system, FlexPlane™ optical flex circuitry, VersaBeam™ expanded beam MT interconnects, VITA 66.1 ruggedized optical MT backplane interconnects and optical EMI shielding adapters. A founding member of the CDFP consortium, Molex will showcase the new zCD™ interconnect for 400 Gbps next-generation applications-the highest bandwidth and densest IO connector on the market today. Additionally, zCD, zQSFP+, and iPass+ HD will be featured in OIF demonstrations (booth #2309).
 
Company: MRV (News - Alert) Communications
Booth: 4545
Ticker Symbol & Exchange: OTCQB: MRVC
Web: www.mrv.com
Press Kit: http://www.tradeshownews.com/events/OFC-2014/MRVCommunications/
MRV Communications is a global leader in converged packet and optical solutions that empower the optical edge. For more than two decades, the most demanding service providers, Fortune 1000 companies and governments worldwide have trusted MRV to provide best-in-class solutions and services for their mission-critical networks. MRV helps its customers overcome the challenge of orchestrating the ever-increasing need for capacity while improving service delivery and lowering network costs for critical applications such as cloud connectivity, high-capacity business services, mobile backhaul and data center connectivity.
 
Company: NeoPhotonics
Booth: 1815
Ticker Symbol & Exchange: NYSE: NPTN
Web: www.neophotonics.com
NeoPhotonics is a leading designer and manufacturer of photonic integrated circuit, or PIC, based optoelectronic modules and subsystems for bandwidth-intensive, high-speed communications networks. The company's products enable cost-effective, high-speed data transmission and efficient allocation of bandwidth over communications networks. NeoPhotonics maintains headquarters in San Jose, California and ISO 9001:2000 certified engineering and manufacturing facilities in Silicon Valley (USA) and Shenzhen, China. NeoPhotonics is showcasing at OFC its 100G Client transceivers alongside its existing product portfolio, including intradyne coherent receivers and narrow line-width tunable lasers for 100G coherent communications and an extensive line of next generation transceivers for access networks.
 
Company: Ranovus
Booth: 4573
Web: www.ranovus.com
RANOVUS, with operations in Ottawa, Canada and San Jose, USA, develops and manufactures advanced solutions for the next generation of interconnects for the telecommunications and information technology industries. Our team has extensive experience in product development and commercialization of optoelectronics components and transceiver subsystems for the information technology industry. RANOVUS' current disruptive portfolio includes Quantum (News - Alert) Dot Multi-Wavelength Laser technology and advanced digital and photonics integrated circuit technologies that are setting a new industry benchmark for the lowest power dissipation, size and cost for the next generation of optical interconnect solutions. RANOVUS and Mellanox (News - Alert) (NSDQ: MLNX) are announcing "OpenOptics" MSA at OFC.
 
Company: SmarTest
Booth: 3388
Web: smartest.us.com
SmarTest is a privately owned, Santa Clara-based Company, committed to delivering the most innovative and "best in class" T&M solutions to market.
 
SmarTest benefits from the unique knowledge of experienced personnel with superior competence in high speed digital and analog design, production testing, technical sales, application engineering support, sales management and product marketing in electronics high tech products.
 
We've brought BERT, oscilloscopes and many other instruments to market for the big guys, but we wanted to take high speed testing in a new direction. For more information, visit www.smartest.us.com or meet us at booth 3388, at OFC 2014.

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