TMCnet News
Freescale Semiconductor Assigned Patent for Method of Assembling Semiconductor Device Including Insulating Substrate and Heat Sink(Targeted News Service Via Acquire Media NewsEdge) By Targeted News Service ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,170) developed by Junhua Luo, Tianjin, China, Jinzhong Yao, Tianjin, China, and Baoguan Yin, Tianjin, China, for a "method of assembling semiconductor device including insulating substrate and heat sink." The patent application was filed on April 10, 2012 (13/442,878). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=3&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=104&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&s2=%28TX.ASST.%29&OS=ISD/02/04/2014+AND+AS/TX&RS=ISD/02/04/2014+AND+AS/TX Written by Balkishan Dalai; edited by Jaya Anand. BD0207JA0207-976595 (c) 2014 Targeted News Service |