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Research and Markets: STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing AnalysisDUBLIN --(Business Wire)-- Research and Markets (http://www.researchandmarkets.com/research/3qgq9v/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis" report to their offering. System Plus Consulting is proud to publish the reverse costing report of the new 9-DOF IMU supplied by STMicroelectronics (News - Alert). The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope, a 3-axis accelerometer and a 3-axismagnetometer. ST achieves to obtain this package footprint by combining the 3-axis gyroscope and the 3-axis accelerometer function on the same die. This new structure, combined with an Au-Au hermetic bonding process allow ST's to shrink the 6-axis function by more than 35%. The LSM333D is targeted for portable applications: indoor navigation, smart user interface, advanced gesture recognition, gaming and virtual reality input device It provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear accelertion) and ±12 Gauss (magnetic field). This report provides complete teardown of the 9-Axis (News - Alert) IMU with: - Detailed photos - Material analysis - Schematic assembly description - Manufacturing Process Flow - In-depth economical analysis - Manufacturing cost breakdown - Selling price estimation Key Topics Covered: Overview / Introduction - Executive Summary - Reverse Costing Methodology Companies Profile Physical Analysis - Package X-Ray - Package Opening - Package Cross-Section - ASICs Dimensions - ASICs Delayering - ASICs Cross-Section - MEMS Gyro/Accelero Dimensions - MEMS Gyro/Accelero Cap Opening - MEMS Gyro/Accelero Sensing Areas - MEMS Gyro/Accelero Cross-sections - X/Y-Axis Magnetometer Dimensions - X/Y-Axis Magnetometer Delayering - X/Y-Axis Magnetometer Cross-section - Z-Axis Magnetometer Dimensions - Z-Axis Magnetometer Delayering - Z-Axis Magnetometer Cross-section Manufacturing Process Flow - Front-End Manufacturing Process Flows - Description of the Wafers Fabrication Units - Back-End Packaging Process Flow - Back-End Packaging Assembly Unit Cost Analysis - Yields Hypotheses - ASICs Wafer Cost - ASICs Die Cost - MEMS Gyro/Accelero Wafer Cost - MEMS Gyro/Accelero Die Cost - X/Y-Axis Magnetometer Wafer Cost - X/Y-Axis Magnetometer Die Cost - Z-Axis Magnetometer Wafer Cost - Z-Axis Magnetometer Die Cost - Back-End: Packaging Cost - Back-End: Final test & Calibration Cost - LSM333D Component Cost (FE + BE 0 + BE 1) Estimated Price Analysis - Manufacturer Financial Ratios - LSM333D Estimated Selling Price For more information visit http://www.researchandmarkets.com/research/3qgq9v/stmicroelectronics
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