|[December 18, 2012]
Canon U.S.A. Commences Sale of New FPA-3030i5+ Stepper for High-Volume Production of LED, MEMS and Other Environmentally Conscious Devices
LAKE SUCCESS, N.Y. --(Business Wire)--
Canon (News - Alert) U.S.A., Inc., a leader in digital imaging solutions, recently
launched sales of the new FPA-3030i5+ i-line stepper. The FPA-3030i5+ is
designed to provide a long-term manufacturing solution for manufacturers
of energy-efficient, environmentally conscious devices*1
including Light-Emitting Diodes (News - Alert) (LEDs),MicroElectroMechanical Systems
(MEMS)*2 and power semiconductors*3.
As awareness of clean energy and energy conservation continues to
increase, demand has simultaneously increased for new environmentally
conscious technologies including wind and solar power, high-efficiency
vehicles and low-power facilities. As a result, manufacturers of these
devices have unique process requirements that have been incorporated
into the FPA-3030i5+ semiconductor stepper design that, along with
optional equipment available to be purchased separately, will help
facilitate these process requirements.
The FPA-3030i5+ represents a new product platform, designed specifically
to provide a flexible solution for a variety of users, including power
semiconductor, LED and MEMS manufacturers.
Canon FPA-3030 platform provides performance and productivity
The FPA-3030 platform represents an upgrade to earlier Canon "FPA-3000
platform" steppers. The FPA-3030i5+ features an overhauled software
structure and electrical control system that allow application of
optional advanced hardware (e.g., projection lens, wafer stage, and
alignment system) that is not compatible with traditional FPA-3000
The FPA-3030i5+ is capable of providing imaging resolution below 0.35µm*4,
while maintaining overlay accuracy of less than or equal to 40nm*5
and throughput equal to or in excess of 104 wafers per hour*6.
Canon developed the FPA-3030i5+ system to meet and exceed the imaging,
overlay and productivity requirements of those environmentally conscious
devices and MEMS manufacturers.
Canon FPA-3030 platform supports optional equipment designed for
special substrate materials required for energy reducing devices and
The FPA-3030 platform allows the use of optional equipment designed for
the processing of silicon (Si), sapphire (Al2O3), silicon
carbide (SiC) and a wide variety of wafer materials used in
environmentally conscious device manufacturing. Optional equipment for
the FPA-3030i5+ includes warped-wafer handling systems to allow
processing of distorted substrates, and advanced image processing
systems for clear substrates.
With the purchase of the optional Multi-Size Wafer Kit, the FPA-3030i5+
stepper can also be configured to process multiple wafer sizes, and can
beequipped with other optional equipment to help improve productivity
Canon FPA-3030i5+ stepper feature summary
1. FPA-3030i5+ imaging system provides 0.35µm resolution with
a flexible optical system and lens
FPA-3030i5+ lens and optical system specifications equal FPA-3000
Variable Lens NA (0.45-0.63) and illumination Sigma (s, 0.3-0.7 @
NA0.63) allows control of resolution and depth of focus.
The FPA-3030i5+ optical system supports Off-Axis (News - Alert) Illumination and
provides imaging resolution requested by manufacturers of energy
2. FPA-3030i5+ platform enhancements help provide alignment
accuracy and reliability
FPA-3030i5+ is equipped with field-proven stage drive and damper
control systems to provide high stability and reliability.
Wafer stage position is controlled by Laser Interferometer System and
wafer alignment scope.
FPA-3030i5+ is capable of overlay accuracy less than or equal to 40nm
to support production of highly efficient devices.
3. FPA-3030i5+ platform supports optional equipment designed
to process special environmentally conscious device substrates
With the purchase of the optional special-substrate handling system,
the FPA-3030i5+ supports special substrates widely used in
manufacturing of environmentally conscious devices, including silicon
(Si), sapphire (Al2O3) and gallium arsenide
With the purchase of the optional warped wafer handling system the
FPA-3030i5+ supports processing of wafers warped and distorted by
earlier process steps.
FPA-3030i5+ supports overlay correction for random wafer distortion
With the purchase of the optional Multi-Size Wafer Kits, the
FPA-3030i5+ can process multiple wafer sizes (75mm & 100mm; 100mm &
150mm; 150mm & 200mm) without additional configuration change.
4. FPA-3030i5+ platform electrical control system and software
are modernized to help support future semiconductor manufacturing
FPA-3030i5+ adopts systems developed for the "FPA-5500 platform"
steppers. FPA-5500 steppers are widely accepted as a leading exposure
system for high-volume memory devices*7, image sensors*8
and advanced packaging applications.
The new FPA-3030i5+ e-Console software structure allows compatibility
and migration of process and exposure conditions from earlier FPA-3000
Market trends for semiconductor lithography equipment
Demand for low-power consumption systems and vehicles, social
infrastructure improvements such as wind, solar and smart grid products
have increased as society becomes more aware of the importance of
conserving energy and reducing environmental impacts. Semiconductor
lithography equipment supporting environmentally conscious devices must
provide process flexibility to meet the wide range of requirements from
manufacturers of environmentally conscious devices.
About Canon U.S.A., Inc.
Canon U.S.A., Inc., is a leading provider of consumer,
business-to-business, and industrial digital imaging solutions. With
approximately $45.6 billion in global revenue, its parent company, Canon
Inc. (NYSE:CAJ), ranks third overall in U.S. patents registered in 2011†
and is one of Fortune Magazine's World's Most Admired Companies in 2012.
In 2012, Canon U.S.A. has received the PCMag.com Readers' Choice Award
for Service and Reliability in the digital camera and printer categories
for the ninth consecutive year, and for camcorders for the past two
years. Canon U.S.A. is committed to the highest level of customer
satisfaction and loyalty, providing 100 percent U.S.-based consumer
service and support for all of the products it distributes. Canon U.S.A.
is dedicated to its Kyosei philosophy of social and environmental
responsibility. To keep apprised of the latest news from Canon U.S.A.,
sign up for the Company's RSS news feed by visiting www.usa.canon.com/rss.
†Based on weekly patent counts issued by United States Patent
and Trademark Office.
All referenced product names, and other marks, are trademarks of their
Availability and specifications of all products are subject to change
*1 General term for electronic components designed to reduce
*2 Electric machinery microelements used in smartphones, etc. (ex.
*3 Semiconductors to control motors, lighting, and power supply and
*4 1 µm (micrometer) = (1 meter) / ( 1 million)
*5 1 nm (nanometer) = (1 meter) / ( 1 billion)
*6 200mm wafers, 60 shots per wafer
*7 Memory devices used in digital information equipment such as
smartphones and personal computers
*8 Image Sensors used in digital cameras and mobile phone cameras
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