Tensilica to Feature Customer Innovations in Smartphones and Home Entertainment at CES 2013
(Marketwire Via Acquire Media NewsEdge) SANTA CLARA, CA -- (Marketwire) -- 12/18/12 --
Tensilica®, Inc. today announced that it will feature innovations from customers that use the company's dataplane processors (DPUs) in smartphones, digital televisions (DTVs), and home entertainment systems at the 2013 Consumer Electronics Show (CES). In all of these cases, customers use Tensilica DPUs to differentiate their products, providing lower power, higher performance and unique features to stand out from their competition. Tensilica's booth with a demo area and three meeting rooms is located in the South Hall of the Las Vegas Convention Center in Meeting Room 25060. To schedule a meeting, please email firstname.lastname@example.org.
Tensilica will be featuring its audio and baseband DSPs (digital signal processors). Among Tensilica's demonstrations will be:
Voice trigger and voice commands using the HiFi Audio DSP. Fujitsu's F-12C smartphones with integrated HiFi Audio. The latest smartphones for NTT Docomo's 4G LTE network in Japan, which use Tensilica DSPs for the LTE communications. Samsung's 3D Blu-ray Disc™ player with HiFi Audio for 5.1-channel surround sound. HD radios with HiFi Audio. Samsung's DTVs with HiFi Audio. Two new products that will be previewed to customers at the show. Please see your Tensilica sales representative for details.
"Differentiation is the key reason our customers chose Tensilica DPUs for their products," stated Jack Guedj, Tensilica's president and CEO. "Our DPUs help our customers reach their aggressive time-to-market, high performance and low power goals. The Tensilica DPUs help create the 'Wow' factor in our customers' products."
About TensilicaTensilica, Inc. is the leader in dataplane processor IP core licensing, with 200 licensees.
Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica's automated design tools to meet specific and demanding signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.
Tensilica is a registered trademark belonging to Tensilica, Inc. All other company and product names mentioned are trademarks and/or registered trademarks of their respective owners.
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