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Tensilica's Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012
SANTA CLARA, CA, Feb 22, 2012 (MARKETWIRE via COMTEX) --
Tensilica(R), Inc. today announced that it will demonstrate its
leadership in mobile audio/voice and baseband hardware and software
IP (intellectual property) processor cores at stand #1F39 at the
Mobile World Congress 2012 in Barcelona (February 27 - March 1,
2012). Tensilica's DPU (dataplane processor units) IP cores have
recently been designed into leading-edge designs from infrastructure
providers (for macrocell, picocell and femtocell basestations) as
well as handset providers for audio, LTE radio, Bluetooth and other
functions.
"Tensilica has established leadership in LTE baseband PHY and MAC
with multiple design wins in LTE-Advanced and mass production for LTE
smartphones, tablets and dongles," stated Jack Guedj, Tensilica's
president and CEO. "Moreover, our audio and voice IP cores, with over
90 software packages, continue to dominate the mobile, automotive and
home entertainment markets by offering the best combination of
performance, power efficiency, solution completeness and audio/voice
quality," he added. "All Tensilica products are backed by our
state-of-the-art tools for ease-of-programmability and can be
customized to enable feature expansion or differentiation."
Baseband Solutions on Display
The most exciting event at Tensilica's
stand #1F39 in Hall 1 will be the live demonstration of the
simultaneous download of two 1080p HD movies plus an uplink stream
from a video camera. These streams are transmitted using Tensilica's
Atlas LTE eNodeB platform and received using Tensilica's Atlas LTE UE
(user equipment) SPRs (software programmable radios). This showcases
how Tensilica's multi-core reference platforms can offer both
flexibility and low power while performing LTE eNB and UE
transmit/receive functions in real time, with processing strength to
spare. This demonstration uses Tensilica's kernel library and LTE
software from partner mimoOn.
Another highlight of the show will be the emergence of multiple
handsets using Tensilica's DSPs (digital signal processors) and DPUs
to perform the LTE functions for the NTT DOCOMO LTE network in Japan.
Tensilica plans to demonstrate Fujitsu's ARROWS Tab LTE F-01D Tablet
PC and a variety of smartphones now on sale in Japan. Tensilica's
DPUs have been employed by NTT DOCOMO and its partners Fujitsu,
Panasonic and NEC for Japan's LTE designs, with over 4 million
Tensilica cores shipped in LTE handset designs in 2011.
The #1 Audio/Voice DSP Family
Tensilica will demonstrate its
recently introduced HiFi 3 Audio DSP, which provides over 1.5x
performance for voice and audio post-processing over existing
solutions and is supported by the 90+ software packages provided by
Tensilica and its extensive ecosystem partners. Tensilica will also
show speech recognition with a demonstration of Sensory's
TrulyHandsfree Voice Control and an Android demonstration of
low-power audio decode offloaded to HiFi DSP.
Other HiFi Audio DSP demos with key industry partners include:
-- Acoustic Technologies' SoundClear audio enhancement software will be
demonstrated on Maxim's MAX98095 SmartCODEC, which employs Tensilica's
HiFi Audio DSP. This demo performs 2-mic noise elimination when
connected to a GSM module and smartphone to make live calls.
-- QSound's QVoice suite of proprietary voice enhancements for echo
cancellation and noise suppression and microQ software for 3D audio,
stereo expansion, treble and bass boost, and reverb.
-- AM3D's Zirene audio enhancement with stereo expansion, treble and bass
boost, virtual surround and reverb and Diesel Power Mobile for 3D
audio.
-- SRS Labs TruGaming 3D audio and WOW-XT for stereo expansion and treble
and bass boost.
Tensilica is scheduling private meetings and in-depth discussions at
MWC. If interested, please email paula@tensilica.com.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor
IP cores. Dataplane processors (DPUs) are a superset of DSPs and CPUs
that can scale from tiny micro signal processors to programmable
offload accelerators and powerful DSPs. DPUs deliver 10 to 100x the
performance because they can be optimized using Tensilica's automated
design tools to meet specific and demanding signal processing
performance and efficiency targets. Tensilica's DPUs power SOC
designs at many Tier 1 system OEMs and seven out of the top 10
semiconductor companies for designs in mobile wireless, telecom and
network infrastructure, computing and storage, and home and auto
entertainment. For more information on Tensilica's patented,
benchmark-proven DPUs visit www.tensilica.com.
Editors' Notes:
-- Tensilica and Xtensa are registered trademarks belonging to Tensilica,
Inc. All other company and product names mentioned are trademarks
and/or registered trademarks of their respective owners.
-- Tensilica's announced licensees include: Afa Technologies, ALPS,
Aquantia, Astute Networks, Atheros, AMD, Avision, Bay Microsystems,
Brocade, Broadcom, Cavium, Chelsio, Cisco Systems, CMC Microsystems,
Conexant Systems, Design Art Networks, EE Solutions, Epson, Fujitsu
Ltd., Fujitsu Semiconductor, Huawei, iBiquity Digital, Ikanos
Communications, Intel, Juniper Networks, LG Electronics, Lucid
Information Technology, Marvell, Maxim, NEC Corporation, Nethra
Imaging, Novatek, NuFront, NXP, Olympus Optical Co. Ltd., Panasonic
Mobile, Plato Networks, PnpNetwork Technologies, PowerLayer
Microsystems, QLogic, Samsung, Shanghai High Definition Digital
Technology Industrial Corporation SiBEAM, Sirius XM Radio, Sony,
Stretch, TranSwitch Corporation, Triductor Technology, Valens
Semiconductor, Validity Sensors, VIA, Victor Company of Japan (JVC),
and Wolfson Microelectronics.
Press Contacts:
Paula Jones
(408) 327-7343
Email Contact
Erika Powelson
(831) 424-1811
Email Contact
SOURCE: Tensilica
http://www2.marketwire.com/mw/emailprcntct?id=14F0A409410FC765
http://www2.marketwire.com/mw/emailprcntct?id=4B3BF4E65ACC4DCE
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