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Solder Balls Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2017 - 2025NEW YORK, Oct. 16, 2017 /PRNewswire/ -- Solder balls are bumps of solder that has been placed manually or by automated equipment, and are held in place with a tacky flux to provide the contact between the chip package and the printed circuit board. Rise in quality and performance standards from end-user industries and improvement in living standard in developing countries across the globe is observed to boost the demand for solder balls across the globe. In-depth interviews and discussions with a wide range of key opinion leaders and industry participants were conducted to compile this research report. Primary research represents the bulk of research efforts, supplemented by extensive secondary research. Key players' product literature, annual reports, press releases, and relevant documents were reviewed for competitive analysis and market understanding. This helped in validating and strengthening secondary research findings. Primary research further helped in developing the analysis team's expertise and market understanding. Global Solder Balls Market: Market Segmentation The study provides a comprehensive view of the solder balls market by dividing it on the basis of end-use and geography segments. The solder balls market has been segmented into up to 100um, 100um – 400um and 400um and above based on size type. Size type segment have been analyzed based on historic, present, and future trends. Regional segmentation includes the current and forecast demand for solder balls in North America, Europe, Asia Pacific, Latin America, and Middle East & Africa (MEA). Additionally, the report comprises country-level analysis in terms of volume and revenue for various segments. Key countries such as the U.S., Canada, Germany, France, the U.K., Spain, Italy, India, China, Japan, South Africa, Mexico, and Brazil have been included in the study. Market segmentation includes demand for individual applications in all the regions and countries. Global Solder Balls Market: Competitive Landscape The report covers detailed competitive outlook that includes market share and profiles of key players operating in the global market. Key players profiled in the report includes Duksan Metal Co. Ltd., Senju Metal Industry Co. Ltd., Indium Corporation, Nippon Micrometal Corporation, Hitachi Metals Nanotech Co. Ltd. and others. Company profiles include attributes such as company overview, number of employees, brand overview, key competitors, business overview, business strategies, recent/key developments, acquisitions, and financial overview (wherever applicable). The global solder balls market has been segmented as follows: Solder Balls Market – Alloy Type Analysis Lead Solder Balls Lead Free Solder Balls Solder Balls Market – Solder Type Analysis Eutectic Non-Eutectic Solder Balls Market – Size Type Analysis Up to 100um 100um – 400um 400um and above Solder Balls Market – Regional Analysis North America U.S. Canada Europe Germany France U.K. Italy Spain Rest of Europe Asia Pacific China India Japan ASEAN Rest of Asia Pacific Middle East & Africa GCC South Africa Rest of Middle East & Africa Latin America Brazil Mexico Rest of Latin America Read the full report: https://www.reportlinker.com/p05143242 About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place. https://www.reportlinker.com __________________________ Contact Clare: [email protected] US: (339)-368-6001 Intl: +1 339-368-6001 View original content:http://www.prnewswire.com/news-releases/solder-balls-market---global-industry-analysis-size-share-growth-trends-and-forecast-2017---2025-300537460.html SOURCE Reportlinker |