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SMIC branch signs agreement for 2 phase construction project in Beijing
BEIJING, May 15, 2012 (Xinhua via COMTEX) --
SMIC Integrated Circuit Produ
ction (Beijing), the Beijing Municipal Commission of Economy and Infor
mation Technology, and the Administrative Committee Beijing Economic-T
echnological Development Area signed a cooperative framework agreement
here on Tuesday to jointly invest in the construction of SMIC Beijing
's second-phase project.
The second phase project will involve the construction of
new manufacturing buildings in the existing plant and introducing new
equipment for product manufacture using 45/40 nm and 32/28 nm technol
ogy.
The project is expected to provide an advanced platform t
o test the findings of the research in terms of large-scale integrated
circuit manufacturing technology, as well as key equipment and materi
al. It will also help IC companies developing high-end chip products u
sed in CPU, memory, mobile communication, digital video, and audio equ
ipment, and facilitate the large-scale development of Beijing's next-g
eneration Internet, cloud computing, the Internet of Things and other
emerging industries of strategic importance.
SMIC Beijing is a subsidiary of the China-based Semiconductor M
anufacturing International Corp. (SMIC, SMI.NYSE; 00981.HK). (Edited b
y Luo Jingjing, luojj@xinhua.org)
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