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Samsung Signs Multi-Year License for Tensilica's HiFi 2 Audio DSP
(Market Wire Via Acquire Media NewsEdge) SANTA CLARA, CA -- (MARKET WIRE) -- 11/19/09 --
Tensilica,® Inc. today announced
that the Digital Media & Communications Business of Samsung Electronics has
signed a multi-year license to Tensilica's HiFi
2 Audio DSP (digital signal processor) for use in Samsung's multimedia
system products after a successful previous deployment in Samsung's System
LSI Division. Tensilica's HiFi architecture is
the most popular commercial audio core for system-on-chip (SOC) designs.
"We selected the Tensilica HiFi Audio DSP because of its impressive
performance capabilities and because of the breadth of software codecs
available," stated K.W. Chun, vice president, Digital Media &
Communications Business of Samsung Electronics. "The HiFi 2 Audio DSP can
execute the most demanding multi-channel audio algorithms at remarkably low
MHz and low power."
"We are pleased that another major division of Samsung Electronics has
selected our HiFi 2 Audio DSP for their next-generation home
entertainment products," stated Jack Guedj,
Tensilica's president and CEO.
About Tensilica
Tensilica, Inc. is the recognized leader in customizable dataplane
processors. Dataplane Processor Units (DPUs) consist of performance
intensive DSP (audio, video, imaging, and baseband signal processing) and
embedded RISC processing functions (security, networking, and deeply
embedded control). The automated design tools behind all of Tensilica's
application specific processor cores enable rapid customization to meet
specific data-plane performance targets. Tensilica's DSPs and processors
power top tier semiconductor companies, innovative start-ups, and system
OEMs for high-volume products including mobile phones, consumer electronics
devices (including portable media players, digital TV, and broadband set
top boxes), computers, and storage, networking and communications
equipment. For more information on Tensilica's patented benchmark-proven
DPUs visit www.tensilica.com.
Editors' Notes:
-- Tensilica and Xtensa are registered trademarks belonging to Tensilica
Inc. All other company and product names are trademarks and/or registered
trademarks of their respective owners.
-- Tensilica's announced licensees include: ADDMM, Afa Technologies,
ALPS, Aquantia, Astute Networks, Atheros, AMD (ATI), Avision, Bay
Microsystems, Berkeley Wireless Research Center, Brocade, Broadcom, Cisco
Systems, CMC Microsystems, Conexant Systems, Design Art Networks, DS2, EE
Solutions, Epson, ETRI, FUJIFILM Microdevices, Fujitsu Ltd., Hudson Soft,
iBiquity Digital, Ikanos Communications, Intel, Juniper Networks, LG
Electronics, Lucid Information Technology, Marvell, NEC Laboratories
America, NEC Corporation, NetEffect, Neterion, Nethra Imaging, Nippon
Telephone and Telegraph (NTT), NuFront, NVIDIA, Olympus Optical Co. Ltd.,
Panasonic Mobile, Penstar, Plato Networks, PnpNetwork Technologies,
PowerLayer Microsystems, Samsung, SiBEAM, Silicon Optix, Sony,
STMicroelectronics, Stretch, TranSwitch Corporation, Triductor Technology,
u-Nav Microelectronics, UpZide, Valens Semiconductor, Validity Sensors,
Victor Company of Japan (JVC), WiLinx, WiQuest Communications, and XM
Radio.
Press Contacts:
Paula Jones
(408) 327-7343
Email Contact
Erika Powelson
(831) 424-1811
Email Contact
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