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Research and Markets: Power Electronics for Hybrid & Electric Vehicles, Volume 1 Active Components
(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/8f53c8/power_electronics) has announced the addition of the "Power Electronics for Hybrid & Electric Vehicles, Volume 1 Active Components" report to their offering.
New materials for active components will significantly impact packaging & cooling systems
A +$2 billion market for modules: a big opportunity for power electronics
In 2016, almost 25 million cars manufactured will be electrified, the majority of them being micro-HEV, with a low level of electrification. However, some 5 million will be full HEV, plug-in HEV or EV.
As a consequence, electric vehicles (EV) and hybrid electric vehicles (HEV) will represent the biggest accessible market for power device and system makers. Without getting completely mature, the EV/HEV industry has seen its first steps toward standardization. Electrical configuration shows a preference for parallel and split structures. Following the same logic, DC/DC boost converters and DC/AC inverters architecture for full HEV and EV are adopted. Getting the best switch at the lowest cost is a must. IGBT will continue having a bright future in hybrid and electric cars.
We expect the power module market to be near $5 Billion, most made with IGBT. It is huge and will change the game in power electronics market!
But there are still some uncertainties:
- What about new power semiconductor device adoption?
- Which materials will be preferred?
- What are the consequences on the rest of the powertrain? Cooling? Integration? Connectivity? Passives?
- What are the consequences on the supply chain?
ELECTRICAL ARCHITECTURES ARE CHOSEN BUT SUPPLY CHAIN KEEPS ON CHANGING
CHINA: MARKET OPPORTUNITY OR COMPETITIVE THREAT?
TECHNOLOGY DEVELOPMENTS: ACTIVE, PASSIVES AND SYSTEM INTEGRATION
NEW MATERIALS FOR ACTIVE COMPONENTS ARE ENVISIONED AND WILL SIGNIFICANTLY IMPACT PACKAGING & COOLING SYSTEMS
Key Topics Covered:
Before we start?
Executive summary
EV HEV market
- Worldwide car market
- HEV market
- EV and plug-in HEV
- Focus on Chinese market
Architectures and power systems
- HEV architectures and power control units
- Assembly and design
- Supply chain
- Power electronics uses in HEV/EV
VOLUME 1 - ACTIVE Components
- Semiconductors module packaging
- SiC & GaN trends in EV/HEV
- Silicon, SiC & GaN device and module recent developments
- SiC and GaN developments
General conclusions
Appendix
For more information visit http://www.researchandmarkets.com/research/8f53c8/power_electronics
CONTACT:
Research and Markets
Laura Wood, Senior Manager,
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to info@m2.com)).
(c) 2012 M2 COMMUNICATIONS
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