Research and Markets - Global Semiconductor Packaging Equipment Market CAGR Growth of 8.04% by 2020 - Trends, Technologies & Opportunities Report 2016-2020 - Key Vendors: Greatek, Nepes, Lingsen Precision

DUBLIN, September 5, 2016 /PRNewswire/ --

Research and Markets has announced the addition of the "Global Semiconductor Packaging Equipment Market 2016-2020" report to their offering.

The global semiconductor packaging equipment market is forecast to grow at a CAGR of 8.04% during the period 2016-2020.

Commenting on the report, an analyst from the research team said: One of the key trends for market growth will be growing number of mergers and acquisitions. The number of mergers and acquisitions is growing in the global semiconductor packaging and assembly equipment market.

The existing vendors are focusing on M&A to increase their market share. For instance, in 2015, ASE agreed to buy a 24.99% stake in SPIL, a provider of advanced packaging solutions, for more than $919 million. Earlier in 2015, SPIL and Hon Hai Precision Industry announced a stock swap to strengthen their product offerings in SiP technology. New entrants in the market also prefer M&A in order to enter in the already highly competitive market.

According to the report, growing number of fabs will be a key driver for market growth. The rising demand for semiconductor chips and memory devices from electronics end-user devices, sensor systems, IoT-connected devices, and medical devices is propelling the semiconductor industry on the high growth trajectory. However, the industry will slow down in 2016 mainly due to its cclical nature, slow growth of the Chinese economy, falling ASPs of smartphones, and declining tablet and PC segments.

The market is expected to gain ground in 2017 due to the evolution of the IoT, high demand for connected devices, and automation in automobiles. In order to meet this growing demand, semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment in new facilities will be toward the development of memory and logic ICs due to their high demand pattern.


Questions Answered:

• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?

Companies Mentioned:

• Applied Materials
• ASM Pacific Technology
• Kulicke and Soffa Industries
• Tokyo Electron Limited
• Tokyo Seimitsu
• ChipMos
• Greatek
• Hua Hong
• Jiangsu Changjiang Electronics Technology
• Lingsen Precision
• Nepes
• Tianshui Huatian¸ Unisem
• Ultratech
  

Report Structure:

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Market research methodology

PART 04: Introduction

PART 05: Technology landscape

PART 06: Market landscape

PART 07: Market segmentation by type

PART 08: Market segmentation by end-user

PART 09: Geographical segmentation

PART 10: Market drivers

PART 11: Impact of drivers

PART 12: Market challenges

PART 13: Impact of drivers and challenges

PART 14: Market trends

PART 15: Vendor landscape

PART 16: Appendix

PART 17: About the Author

For more information about this report visit http://www.researchandmarkets.com/research/jdqlt4/global

Related Topics: Semiconductor

Media Contact:

Research and Markets
Laura Wood, Senior Manager
[email protected]

For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900

U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716

[ Back To TMCnet.com's Homepage ]