Research and Markets Adds Report: STMicroelectronics 3-axis accelerometer using TSV Technology Reverse Costing Analysis
Apr 12, 2012 (Close-Up Media via COMTEX) --
Research and Markets has announced the addition of the "STMicroelectronics 3-axis accelerometer using TSV Technology Reverse Costing Analysis" report to its offerings.
In a release, Research and Markets noted that report highlights include:
Reverse costing report of the world's first 3-Axis MEMS accelerometer supplied by STMicroelectronics and using Through-Silicon-Via technology.
- Physical Analysis of the Devices
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
The Component was extracted from a NOKIA phone and seems to be a special version of the STM 3-Axis Accelerometer LIS302DL. Packaged in a LGA-14 pin package, the device integrates two dies in a side-by-side configuration and features an ultra low-power consumption that allows power saving functions in consumer applications.
By removing the area reserved for I/O pads, the TSV process allows the MEMS die area to be shrinked when compared to the standard accelerometer. The manufacturing process uses an approach similar to the standard THELMA technology, but adds major changes which increase the final wafer cost.
The report also provides a comparative analysis with the standard ST 3-Axis MEMS Accelerometer, the LIS302DL.
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