TMCnet News
Open-Silicon Receives TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, today announced it was presented with TSMC’s OIP Ecosystem Forum 2017 Customers’ Choice Award for best paper. The paper, titled High Bandwidth Memory (HBM2) IP Subsystem Solution Validation and Interoperability with HBM2 Memory Die Stack, was presented at TSMC’s Open Innovation Platform® Ecosystem Forum on September 13, 2017 in Santa Clara, CA.
“TSMC has a very selective process for accepting papers, and those that are chosen represent the highest quality and highest value to our customers,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “Receiving the Customers’ Choice Award for the best paper clearly demonstrates the high level of interest in Open-Silicon’s HBM2 IP subsystem solution and the benefits it offers to our mutual customers using TSMC FinFET and CoWoS® technologies.” “As a TSMC VCA and DCA partner, Open-Silicon has a strong relationship with TSMC,” said Mark Wright, Senior Vice President of Sales and Marketing for Open-Silicon. “We are honored to receive this prestigious award because it demonstrates our commitment to the TSMC ecosystem, and underscores our contribution to the advancement of HBM2 IP and 2.5D ASIC SiP solutions, which enable emerging applications, like deep learning and cloud computing.” About Open-Silicon Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions. All other trademarks are the property of their respective holders. Contact Information: Media Contact A photo accompanying this announcement is available at //www.globenewswire.com/NewsRoom/AttachmentNg/cd757c31-5815-4f06-92b8-d5c3440342e3 |
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