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New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex TechnologiesMUNICH, May 3, 2016 /PRNewswire/ -- Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) unveiled the Allegro® 17.2-2016 portfolio, which enables a more predictable and shorter design cycle. The portfolio features comprehensive in-design inter-layer checking technology that minimizes design-check-redesign iterations and a new dynamic concurrent team design capability that accelerates product creation time by up to 50 percent. Utilizing material inlay fabrication techniques, these new capabilities can reduce material costs by up to 25 percent. In addition, embedded SigrityTM technology now ensures critical signals meet performance criteria and power integrity (PI) for PCB designers addressing power delivery and IR-drop issues efficiently, eliminating time-consuming iterations with PI experts. For more information on the Allegro technology portfolio, please visit http://www.cadence.com/news/allegro172. The Allegro portfolio includes key advancements that minimize design iterations and lower overall cost for flex and rigid-flex designs commonly used in automotive, consumer electronics, computing, communications, mobile and wearable applications. These capabilities include:
"Due to the nature of our business, flex designs are extremely critical to many of our products, specifically in the mobile and automotive space. The breadth and the depth of enhancements have the ability to significantly improve our PCB design productivity in designing for space-constrained applications," said Greg Bodi, director of System Engineering PCB Layout, Nvidia. "The new inter-layer check capability provides comprehensive in-design, real-time checks, which will save us significant time currently spent doing manual checks after layout is completed on advance flex and rigid-flex designs." "The latest Allegro release provides many productivity and ease of use improvements," said Dave Elder, PCB Engineering manager at Tait Communications. "In-design inter-layer checks for flex and rigid-flex design is comprehensive and extensible, which can save us 20 to 25 percent time for rigid-flex designs. This will also allow us to retire some homegrown solutions we put in place." "The new Allegro platform addresses many challenges faced by PCB designers on a daily basis," said Saugat Sen, vice president of R&D, PCB and IC Packaging Group at Cadence. "We continue to provide market-leading solutions with Allegro's extensive Rigid/Flex capabilities coupled with industry-leading power aware Sigrity SI/PI technology to reduce design cycle time for our customers' compact, high-performance products." About Cadence © 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Allegro, Cadence and the Cadence logo are registered trademarks and Sigrity is a trademark of Cadence Design Systems, Inc. in the United States and other countries. For more information, please contact: Photo - http://photos.prnewswire.com/prnh/20160428/361492
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/new-cadence-allegro-platform-accelerates-design-of-compact-high-performance-products-using-flex-and-rigid-flex-technologies-300259944.html SOURCE Cadence Design Systems, Inc. |