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Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" WafersEDMONTON, Alberta, June 22, 2017 /PRNewswire/ -- Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications. The companies engaged in the development of the TSV offering in 2016 and are pleased to offer full volume production capability starting July 2017. "Microplex has a long history of supplying "thru-via" technology to various markets", said Clay Kucenas, President and CEO of Microplex, "our partnership with Micralyne provides new access to fast growing sensor and MEMS applications driven by IoT, Medical and Optical devices. The companies have agreed to work jointly to deliver standalone TSV wafers as well as integrated TSV solutions with metal layers for interposer and redistribution layers. Micralyne will also offer multilayer Wafer Level Packaging (WLP) with metal TSV technologies for ball grid array sensors. Minimum via hole diameters as small as 40um, and 70um pitches are currently being fabricated. The diameter to depth ratio of the via holes can exceed 20:1 providing a flexible and robust wafer thickness. Conductive via fills are available in Gold, Silver. and Copper metals. Optimized via processing and unique formulations assures effective performance in high frequency device applications while maintaining the purity of the base silicon micostructures. To learn more about the Metal TSV technology, please visit www.micralyne.com or www.microplexinc.com. "The ability to offer a metal TSV capability to sensor and MEMS applications is truly exciting," said Paul Pickering, Micralyne Vice President of Business Development. "Dozens of opportunities come through Micralyne every year that need the performance and flexibility of this technology. Micralyne can now offer a world class solution for these applications." About Micralyne Inc. Headquartered in Edmonton, Alberta, Canada, Micralyne's diverse customer base includes Fortune 500 companies, mid-range industrial and biomedical companies, and pioneering high-tech start-ups. With a proven manufacturing track record and a rich development history, Micralyne commercializes complex MEMS devices to enable the intelligence and interactivity of its customers' products. In January of 2015, Micralyne was acquired by FTC Technologies. About Microplex, Inc. Microplex offers customized fabrication of "thru-via" products with expertise in high temperature metallized vias. Metallized vias can be processed in silicon, glass, alumina, and quartz substrate materials. Metallized fine diameter vias can be achieved in both wafers and panels. Conductive metals commonly utilized within the vias are copper, silver, and gold. Microplex supports prototype builds as well as moderate quantity volume production. Further details are available on www.microplexinc.com. Media contacts: Lynn Getzinger Micralyne Inc
To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/micralyne-and-microplex-partner-to-deliver-metal-through-silicon-via-wafers-300478152.html SOURCE Micralyne 
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