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KYOCERA Develops Temperature Characteristics-Free Etalon Filter
KYOTO, Japan --(Business Wire)--
Kyocera (News - Alert) Corporation (NYSE:KYO)(TOKYO:6971) today announced that its
wholly owned subsidiary Kyocera Crystal Device Corporation, in charge of
development and manufacturing of crystal devices, has succeeded in
developing a temperature characteristics-free etalon filter - a crystal
device which has applied the atomic diffusion bonding technique for the
first time in the industry*1.
An etalon filter is a component which detects deviations in multiple
light wavelengths in high-capacity optical communication transmissions
systems. For this new product, Kyocera Crystal Device has realized a
temperature characteristics-free etalon filter with high-accuracy,
high-reliability and smaller size due to its success in developing a
crystal device applying the atomic diffusion bonding technique. The
product will be available on a sample basis starting January 2013.
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Product name:
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Temperature characteristics-free etalon filter (C type)
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Applications:
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Tunable laser module for optical communications and industrial use
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Main specs:
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- External dimensions: >1.2mm squared
- Adaptive wavelength: 1,520 to 1,620nm
- Temperature characteristics: ±0.15pm /°C typ. (pm/°C = 10-12m/°C)
- FSR: 50/100GHz
- Extinction ratio or reflectance: Custom
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Availability:
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Starting in January 2013
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Production facilities:
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KYOCERA Crystal Device Hokkaido Corporation (Japan)
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Main Features
1. Industry-leading product specifications enable freedom from
temperature characteristics
The new product has achieved an industry-leading level of temperature
characteristics of ±0.15pm/°C. This was achieved by applying a design
technique combining positive temperature characteristic crystals with
negative temperature characteristic crystals and an advanced crystal
processing technique, along with industry's first application of the
atomic diffusion bonding technique. Furthermore, since the temperature
characteristics-free etalon filter does not require a Peltier device for
temperature adjustment, it can contribute to downsizing and energy
conservation in tunable laser modules.
2. Industry's first crystal device to apply atomic diffusion
bonding technique
The atomic diffusion bonding technique is a direct bonding technique
developed by Tohoku University's Professor Takehito Shimatsu. It entails
bonding the wafer and substrate together without applying heat, pressure
or voltage, nor using organic adhesives. Through the joint-development
with Professor Shimatsu's research group, Kyocera Crystal Device has
succeeded in bonding a crystal wafer in an extremely thin metal film
thickness of several atomic layers to several dozen nanometers*2
with high strength by applying the atomic diffusion bonding technique
for crystal devices. This method has solved the problems of optical
contact*3, a conventional bonding method with lower bonding
strength, and that of bonding using organic adhesive, for which the
management of bonding thickness is difficult. It has also improved
accuracy and reliability while reducing the size of the etalon filter.
Development Background
An etalon filter is a component which monitors whether oscillation of
light wavelength is steadily conducted in the tunable laser module - an
essential device used for high-capacity optical communication
transmission systems - which transforms electric signals to optical
signals for oscillation.
In recent years, optical communication has become increasingly essential
to achieve higher capacity and higher transmission speeds with the
dramatic increase in information volume due to the rapid spread of the
Internet and transmission of high-volume data. To respond to such
requirements, the utilization of the WDM*4 transmission
system, which can transmit more optical signals (information volume)
with one piece of optical fiber, has become the mainstream method. Since
a WDM transmission system requires many tunable laser modules for each
station from mid- to long-distance to short-distance transmissions,
further reduction in size and electric power consumption is required.
As the product does not require a Peltier device for temperature control
due to the aforementioned features, it can contribute to reduction in
the size and electric power consumption of tunable laser modules. Even
with its small size, this product has realized freedom from temperature
characteristics, high accuracy and high reliability, and has superior
stability against changes in external temperature.
Kyocera Crystal Device has an integrated production system, in which all
the processes from cultivation of crystal materials to design,
processing, coating and characteristics evaluation are all conducted
internally. The company will continue to enhance its support of optical
transmission-related fields in order to contribute to the further
progress and development of high-capacity, high-speed optical
communications networks.
*1 As of November 15, 2012. Based on a survey by Kyocera
Crystal Device. *2 1 nanometer (nm) = 1.0x10-9m. *3
Bonding method that does not use adhesive but bonds flat surfaces of the
wafer together. *4 WDM: Wavelength Division
Multiplexing. A communication technology that utilizes optical fiber.
For see more info and images of this product: http://global.kyocera.com/news/2012/1202_hina.html
About
KYOCERA
Kyocera
Corporation (NYSE:KYO)(TOKYO:6971) (http://global.kyocera.com/),
the parent and global headquarters of the Kyocera Group, was founded in
1959 as a producer of fine
ceramics (also known as "advanced ceramics"). By combining these
engineered materials with metals and plastics, and integrating them with
other technologies, Kyocera has become a leading supplier of electronic
components, semiconductor packages, telecommunications equipment, solar
power generating systems, printers, copiers, cutting tools and
industrial ceramics. During the year ended March 31, 2012, the company's
net sales totaled 1.19 trillion yen (approx. USD14.5 billion). The
company is ranked #426 on Forbes magazine's 2012 "Global 2000"
listing of the world's largest publicly traded companies.

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