[November 13, 2017] |
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Kulicke & Soffa to Participate at Productronica 2017
Kulicke & Soffa Industries (News - Alert), Inc. (NASDAQ: KLIC) ("Kulicke & Soffa",
"K&S" or the "Company"), announced today that it will be exhibiting at
the Productronica trade show, from November 14 through November 17, 2017.
Kulicke & Soffa will introduce its new Automotive focused solution,
Rapid Pro™, and showcase several other assembly offerings.
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Rapid Pro™ - the first in the new GEN-S performance wire bonder
series, Rapid Pro™ delivers advanced process capabilities to
further drive factory efficiency. Real-time monitoring and diagnostics
ensure high quality and efficient assembly for automotive and other
high-performance, high-reliability semiconductor applications. The
GEN-S series also provides smart factory capabilities to further
enhance operational efficiencies.
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Asterion™- is built on a new architecture with enhanced
capabilities addressing the industry's growing and evolving power
control and storage needs. A single platform handles a multitude of
interconnect materials such as large aluminum wire, PowerRibbon™
and interconnects for battery cells.
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APAMA™ DA (Die Attach) - is a next generation platform that
delivers high throughput and yields by leveaging unique advances in
functionality which includes parallel processing, post pick alignment
and inspection as well as patented dynamic calibration technology.
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iFLEX - With a new placement head design, it could achieve
placement up to 50mm parts on a panel with 50mm pre-mount. This allows
the full automation of the pick and place process, eliminating the
manual operation. The iFLEX offers high flexibility, fast changeovers
for inline and end of line placements as well as the lowest defect
rates.
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Hybrid Wafer Feeder - an innovative solution that enables the
combination of ultra-high-speed passive and active placement with
high-accuracy flip-chip bonding directly from wafer, ideal for
high-volume System-in-Package (SiP), flip-chip, die-attach and
wafer-level-package manufacturing. Placement accuracy up to 7µm @ 3
sigma, provides a compelling alternative to existing commercial
solutions.
The Company will be demonstrating these products at Messe München, Hall
A2, booth number 139.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor
packaging and electronic assembly solutions supporting the global
automotive, consumer, communications, computing and industrial segments.
As a pioneer in the semiconductor space, K&S has provided customers with
market leading packaging solutions for decades. In recent years, K&S has
expanded its product offerings through strategic acquisitions and
organic development, adding advanced packaging, electronics assembly,
wedge bonding and a broader range of expendable tools to its core
offerings. Combined with its extensive expertise in process technology
and focus on development, K&S is well positioned to help customers meet
the challenges of packaging and assembling the next-generation of
electronic devices. (www.kns.com)
View source version on businesswire.com: http://www.businesswire.com/news/home/20171113005478/en/
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