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Global PCB Industry Report, 2015-2020NEW YORK, Aug. 30, 2016 /PRNewswire/ -- The biggest change in PCB industry in 2017 will be wider application of substrate like. According to Apple's suppliers, iPhone 7S/8 to be launched in 2017 will see some substantial upgradings in specification with substrate-like HDI replacing commonly-used HDI so as to massively import System in Package (SiP) technology with the aim of modularizing sub-system. Compared with traditional HDI, the biggest change in the specification of substrate-like HDI is the line space/width on circuit board which moves toward fine pitch in order to work properly with SiP technology. Particularly, the line space/width must be miniaturized below 35 micrometers. In such case, traditional PCB HDI process cannot meet technical requirements on fine pitch, and large sums of money are needed to upgrade manufacturing equipment and re-explore production processes. By contrast, IC substrate vendors can easily produce such PCB, showing overwhelming superiority. According to Apple's suppliers, for iPhone 7S/8 to be launched in 2017, the original one large traditional HDI board will be disassembled into four small substrate-like HDI boards, thus not only speeding up import of SiP technology but also freeing up more space for larger battery capacity. Apple has asked suppliers to send samples in the third quarter, attracting IC substrate vendors including Ibiden, Kinsus, and Unimicron to scramble for orders. However, it now seems that Kinsus, a key SiP board supplier for Apple, has the best chance of winning substrate-like HDI order, and ASE Group is likely to grab SiP packaging & testing order. Read the full report: http://www.reportlinker.com/p04091851-summary/view-report.html About Reportlinker ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need - instantly, in one place. http://www.reportlinker.com __________________________ Contact Clare: [email protected] US: (339)-368-6001 Intl: +1 339-368-6001 To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-pcb-industry-report-2015-2020-300320044.html SOURCE Reportlinker |