Global Interconnect Market - 2015-2019 - Key vendors are Amphenol, Foxconn, Molex, TE Connectivity & Yazaki

DUBLIN, Nov. 27, 2015 /PRNewswire/ -- Research and Markets (http://www.researchandmarkets.com/research/mh7cdx/global) has announced the addition of the "Global Interconnect Market 2015-2019" report to their offering.

According to the report, one key driver of this market is the growing demand for mobility. The automotive segment is one of the major end-users in the interconnect market. There is escalating demand for customized connectors and cable assemblies designed for varied models of automobile. In addition, with the growth in the population worldwide, investment in public and private transport is expected to increase during the forecast period.

Real-time data for industrial applications is also a major trend in the market. With the advances in hardware components and overall systems, the integration of electronics with industrial applications is becoming increasingly important. The introduction of IT intelligence across the shop floor ensures real-time data from the connected devices.

Further, the report states that one of te major challenges is absence of uniform standard. The interconnect market caters to industries that need to comply with specific voltage frequency, standards, and plug patterns in their home countries. There is no uniform standard throughout the world. 

The analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019.

Key Questions Answered in this Report:

• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

Key Topics Covered:

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

04. Market Research Methodology

05. Introduction

06. Market Landscape

07. Geographical Segmentation

08. Market Segmentation by Product

09. Market Segmentation by End-users

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape

18. Key Vendor Analysis

19. Other Reports in this Series

Key Vendors:

• Amphenol
• Foxconn
• Molex
• TE Connectivity
• Yazaki

Other Prominent Vendors:

• 3M
• Alstom SA
• Belden Incorporated
• Delphi
• JST
• Phoenix Contact
• Rosenberger
• Sumitomo Wiring Systems

For more information visit http://www.researchandmarkets.com/research/mh7cdx/global

Media Contact:

Laura Wood, +353-1-481-1716, [email protected]

To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-interconnect-market---2015-2019---key-vendors-are-amphenol-foxconn-molex-te-connectivity--yazaki-300184934.html

SOURCE Research and Markets

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