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Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/zhjmns/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Equipment Industry Report, 2013-2014 " report to their offering. Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging is primarily used in the following 5 fields, namely, Analog & Mixed Signal (including IPD, PA, PMU, Local Power, IC Driver, and Audio & Video), Wireless Connectivity (including Bluetooth FM WLAN Combo and GPS Single Chip), Optoelectronic (including CIS, AL Sensor), MEMS & Sensor (including Accelerometers, Gyroscope, RF-MEMS, Pressure Sensor, and Fingerprint Sensor), as well as Misc Logic and Memory (covering Logic gate and EEPROMs). And these applications mostly adopt the Fan-in design, with the number of Pin usually less than 20. In future, WLCSP will be required to follow the Fan-out design to expand its applications. However, the current Fan-out design, which is not mature, restricts the application of wafer level packaging, leaving an untapped market potential for now. But if the Fan-out design is mature, WLCSP will embark on a new development stage. With obvious periodicity, semiconductor devices saw a rise during 2001-2007 but a slump in 2008-2009, while fiercely surged by 100% in 2011, then declined for 3 consecutive years from 2011. And in 2014, they will witness an explosive growth, with the estimated market size of die packaging level equipment rising significantly by 20% to USD4.1 billion. And this figure is projected to climb to USD4.3 billion in 2015 and then begin to fall in 2016. The major growth engine would be Die Bonder, Flip-chip Bonder, and Test Handler. Key Topics Covered: 1. Global Semiconductor Industry 2. Upstream & Downstream of IC Packaging Industry 3. Packaging & Testing Technology Trend 4. Packaging Equipment Industry 5. Packaging Equipment Vendors Companies Mentioned - Advantest - Asm Pacific - Besi - Disco - Group - Hanmi - Hitachi High-Technologies - Kulicke & Soffa - Pfsa - Shinkawa - Suss Microtec - Teradyne - Tokyo Seimitsu - Towa - Ultratech For more information visit http://www.researchandmarkets.com/research/zhjmns/global_and CONTACT: Research and Markets, Laura Wood, Senior Manager. [email protected] Fax from USA: 646-607-1907 Fax from rest of the world: +353-1-481-1716 Sector: Semiconductor (http://www.researchandmarkets.com/categories.asp?cat_id=102&campaign_id=zhjmns), Packaging (http://www.researchandmarkets.com/categories.asp?cat_id=329&campaign_id=zhjmns) . (c) 2014 M2 COMMUNICATIONS |