TMCnet News

Bharat Book Bureau: System-in-Package (SiP) Die Technologies and Global Markets
[April 22, 2014]

Bharat Book Bureau: System-in-Package (SiP) Die Technologies and Global Markets


(M2 PressWIRE Via Acquire Media NewsEdge) Global sales for System-in-Package (SiP)-based chipsets totaled nearly $15 billion in 2012. This market is expected to grow at a compound annual growth rate (CAGR) of 6.7% from nearly $16.3 billion forecast for 2013 to $22.5 billion forecast for 2018.



This report provides: -An overview of the global market for System-in-Package (SiP) chipsets.

-Analyses of global market trends, with data from 2012, estimates for 2013, and projections of compound annual growth rates (CAGRs) through 2018.


-A breakdown of the market along two major criteria; die technologies and end-use applications.

-A look at many market verticals including telecommunications; medicine; computing and entertainment; consumer electronics, -instrumentation and scientific research; energy, defense, and surveillance; and industrial and automotive.

-Comprehensive profiles of leading companies in the industry.

INTRODUCTION System-in-package (SiP) is a combination of integrated circuits (ICs) enclosed in a single package or module. Additionally, passive components are mounted on the same substrate. SiP is not just an IC package with multiple dies; it comprises fully functional systems or subsystems in an IC package format.

SiP, while being a packaging technique, differs substantially from other packaging technologies. The latter largely involve minimal complex design considerations, whereas for SiP, an effective subsystem or system, the interconnection and integration are substantially more complex.

SiP brings tangible gains in space reduction. While system-on-chip (SoC) achieves the same objective more effectively, SoC design is more complex and time consuming than SiP. SiP's simplicity has opened a wide array of uses for it in less than a decade since its inception. However, SiP also faces significant challenges in being able to assure form yield maximization.

This report attempts to weigh the positives of SiP with the negatives in quantitative as well as qualitative contexts.

STUDY GOALS AND OBJECTIVES This study has the following goals and objectives: -Measuring and forecasting the global market size for SiP-based chipsets in value (dollar sales) and volume (shipment sales) terms.

-Breaking down the market for global SiP-enabled chipsets components along the following end applications in value and volume terms: telecommunications; instrumentation and scientific research; medicine; energy, defense and surveillance; consumer electronics; industrial and automotive; retail; and others.

-Breaking down individual SiP-enabled chipset end-use applications along the following die compositions in value and volume terms: compound semiconductors and silicon (Si).

-Breaking down individual SiP-enabled chipset end-use applications along the following regions in value and volume terms: the Americas; Europe, Middle East and Africa (EMEA); and Asia-Pacific (APAC).

-Breaking down individual SiP-enabled chipset end-use applications along the following countries in value and volume terms: U.S., -Brazil, Canada, Mexico, Germany, U.K., France, Italy, Spain, Russia, the Netherlands, Turkey, China, Japan, India, Indonesia and South Korea.

-Analyzing the stakeholder landscape in the SiP-enabled chipset value chain.

-Analyzing the patenting activity involving SiP-enabled chipsets.

To know more:https://www.bharatbook.com/consumer-electronics-market-research-reports-314857/system-in-package-sipdie-technologies-and-global-markets.html OR Contact us at : Bharat Book Bureau Tel: +91 22 27810772+91 22 27810772 / 27810773 Toll Free No for USA/Canada : 1-866-279-83681-866-279-8368 For live chat : http://bit.ly/19m3TU4 Email: [email protected] Website: www.bharatbook.com Follow us on twitter: https://twitter.com/researchbook Follow us on linkedin : http://www.linkedin.com/company/bharat-book-bureau Our Blog : http://blog.bharatbook.com/CallSend SMSAdd to SkypeYou'll need Skype CreditFree via Skype .

(c) 2014 M2 COMMUNICATIONS

[ Back To TMCnet.com's Homepage ]