[August 30, 2016] |
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Global Semiconductor Packaging Equipment Market Will Witness the Dominance of APAC Through 2020 Due to the Large Presence of OSATs and IDMs: Technavio
The global
semiconductor packaging equipment market is expected to
grow at a CAGR of more than 8% during the forecast period, according to
Technavio's latest report.
In this report, Technavio
covers the market outlook and growth prospects of the global semiconductor
packaging equipment market for 2016-2020. To calculate the
market size, Technavio considers the sale of semiconductor packaging
equipment to the end-users - OSATs and IDMs.
Based on different types of packaging equipment, the die-level packaging
equipment segment dominated the market in 2015, accounting for a share
of 61.58%. This segment is expected to grow at a CAGR of close to 6%
during the forecast period due to growing demand for system-on-chip
(SoC) technology. Also, the increasing demand for application processors
and basebands, which are integrated into mobile and consumer electronic
devices, will indirectly create demand for die-level packaging equipment
during the forecast period.
Technavio's research study segments the global semiconductor packaging
equipment market into the following regions:
Segmentation by region 2020 (% share)
APAC
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72.07%
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North America
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22.36%
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Europe
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5.57%
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Source (News - Alert): Technavio
APAC: largest semiconductor packaging equipment market
APAC dominates the global semiconductor packaging equipment market due
to the presence of numerous major foundries such as Taiwan
Semiconductor Manufacturing, United Microelectronics, Samsung,
and Semiconductor Manufacturing International (News - Alert). It is also home to
major OSATs such as ASE and STATS ChipPAC. These manufacturers are
investing heavily to revamp their production lines, which is creating
demand for production equipment in the market.
The utilization of semiconductor devices is the largest in APAC due to
the presence of leading consumer electronics manufacturers such as
Samsung, Sony, LG, Toshiba, and Panasonic. Moreover, major global
companies such as Apple (News - Alert) and HP also have their production facilities in
the region. The consumer electronic device market is likely to grow
significantly during the forecast period, propelling the growth of the
global semiconductor market. This will trigger the demand for
semiconductor manufacturing and processing equipment such as
semiconductor packaging equipment in APAC.
Ask for a sample of this report: http://goo.gl/7ZKuaE
Semiconductor packaging equipment market in North America
The US is the base for a couple of major semiconductor manufacturers
such as GlobalFoundries and Intel (News - Alert). This is expected to
drive the demand for packaging equipment in the region. For instance,
Intel is constructing a new fab facility in the US, creating demand for
manufacturing equipment.
Moreover, a few major car and flat-panel
display manufacturers present in the region will create demand
for semiconductor devices. Further, the high adoption rate of
communication devices such as smartphones and phablets will boost
the production of semiconductor devices, creating the need for
semiconductor packaging systems in the region.
Semiconductor packaging equipment market in Europe
The semiconductor packaging equipment market in Europe was valued at USD
64.09 million in 2015. The market is expected to grow at a CAGR of 6.69%
during the forecast period to generate revenue of USD 88.61 million by
2020.
The growth rate of the market in Europe is low compared to other
regional segments, due to the presence of a lower number of semiconductor
foundries and semiconductor IC manufacturers. Further,
the low concentration of electronic device manufacturers in the region
reduces the need for semiconductor devices, and consequently for
semiconductor manufacturing equipment.
Moreover, the Brexit crisis in the EU will force many manufacturers to
shift their foundries to APAC or outsource their packaging facilities to
APAC-based OSATs, due to the availability of cheaper resources.
The top vendors in the global semiconductor packaging equipment market
highlighted in the report are:
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Applied Materials
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ASM (News - Alert) Pacific Technology
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Kulicke & Soffa Industries
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Tokyo Electron
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TOKYO SEIMITSU
Browse Related Reports:
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About Technavio
Technavio
is a leading global technology research and advisory company. The
company develops over 2000 pieces of research every year, covering more
than 500 technologies across 80 countries. Technavio has about 300
analysts globally who specialize in customized consulting and business
research assignments across the latest leading edge technologies.
Technavio analysts employ primary as well as secondary research
techniques to ascertain the size and vendor landscape in a range of
markets. Analysts obtain information using a combination of bottom-up
and top-down approaches, besides using in-house market modeling tools
and proprietary databases. They corroborate this data with the data
obtained from various market participants and stakeholders across the
value chain, including vendors, service providers, distributors,
re-sellers, and end-users.
If you are interested in more information, please contact our media team
at [email protected].
View source version on businesswire.com: http://www.businesswire.com/news/home/20160830005079/en/
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