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TMCNet:  Global Semiconductor Packaging Equipment Market Will Witness the Dominance of APAC Through 2020 Due to the Large Presence of OSATs and IDMs: Technavio

[August 30, 2016]

Global Semiconductor Packaging Equipment Market Will Witness the Dominance of APAC Through 2020 Due to the Large Presence of OSATs and IDMs: Technavio

The global semiconductor packaging equipment market is expected to grow at a CAGR of more than 8% during the forecast period, according to Technavio's latest report.

In this report, Technavio covers the market outlook and growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, Technavio considers the sale of semiconductor packaging equipment to the end-users - OSATs and IDMs.

Based on different types of packaging equipment, the die-level packaging equipment segment dominated the market in 2015, accounting for a share of 61.58%. This segment is expected to grow at a CAGR of close to 6% during the forecast period due to growing demand for system-on-chip (SoC) technology. Also, the increasing demand for application processors and basebands, which are integrated into mobile and consumer electronic devices, will indirectly create demand for die-level packaging equipment during the forecast period.

Technavio's research study segments the global semiconductor packaging equipment market into the following regions:

Segmentation by region 2020 (% share)






APAC   72.07%
North America   22.36%
Europe   5.57%

Source (News - Alert): Technavio

APAC: largest semiconductor packaging equipment market

APAC dominates the global semiconductor packaging equipment market due to the presence of numerous major foundries such as Taiwan Semiconductor Manufacturing, United Microelectronics, Samsung, and Semiconductor Manufacturing International (News - Alert). It is also home to major OSATs such as ASE and STATS ChipPAC. These manufacturers are investing heavily to revamp their production lines, which is creating demand for production equipment in the market.

The utilization of semiconductor devices is the largest in APAC due to the presence of leading consumer electronics manufacturers such as Samsung, Sony, LG, Toshiba, and Panasonic. Moreover, major global companies such as Apple (News - Alert) and HP also have their production facilities in the region. The consumer electronic device market is likely to grow significantly during the forecast period, propelling the growth of the global semiconductor market. This will trigger the demand for semiconductor manufacturing and processing equipment such as semiconductor packaging equipment in APAC.

Ask for a sample of this report: http://goo.gl/7ZKuaE

Semiconductor packaging equipment market in North America

The US is the base for a couple of major semiconductor manufacturers such as GlobalFoundries and Intel (News - Alert). This is expected to drive the demand for packaging equipment in the region. For instance, Intel is constructing a new fab facility in the US, creating demand for manufacturing equipment.

Moreover, a few major car and flat-panel display manufacturers present in the region will create demand for semiconductor devices. Further, the high adoption rate of communication devices such as smartphones and phablets will boost the production of semiconductor devices, creating the need for semiconductor packaging systems in the region.

Semiconductor packaging equipment market in Europe

The semiconductor packaging equipment market in Europe was valued at USD 64.09 million in 2015. The market is expected to grow at a CAGR of 6.69% during the forecast period to generate revenue of USD 88.61 million by 2020.

The growth rate of the market in Europe is low compared to other regional segments, due to the presence of a lower number of semiconductor foundries and semiconductor IC manufacturers. Further, the low concentration of electronic device manufacturers in the region reduces the need for semiconductor devices, and consequently for semiconductor manufacturing equipment.

Moreover, the Brexit crisis in the EU will force many manufacturers to shift their foundries to APAC or outsource their packaging facilities to APAC-based OSATs, due to the availability of cheaper resources.

The top vendors in the global semiconductor packaging equipment market highlighted in the report are:

  • Applied Materials
  • ASM (News - Alert) Pacific Technology
  • Kulicke & Soffa Industries
  • Tokyo Electron
  • TOKYO SEIMITSU

Browse Related Reports:

Do you need a report on a market in a specific geographical cluster or country but can't find what you're looking for? Don't worry, Technavio also takes client requests. Please contact [email protected] with your requirements and our analysts will be happy to create a customized report just for you.

About Technavio

Technavio is a leading global technology research and advisory company. The company develops over 2000 pieces of research every year, covering more than 500 technologies across 80 countries. Technavio has about 300 analysts globally who specialize in customized consulting and business research assignments across the latest leading edge technologies.

Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.

If you are interested in more information, please contact our media team at [email protected].


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