[May 24, 2016] |
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Invensas to Showcase 3D Packaging, Interconnect and Bonding Solutions at IEEE Electronic Components and Technology Conference
Tessera Technologies (News - Alert), Inc. (Nasdaq: TSRA), announced today that its
wholly owned subsidiary Invensas Corporation will showcase its advanced
semiconductor packaging and interconnect solutions at the upcoming IEEE (News - Alert)
Electronic Components and Technology Conference, taking place May
31-June 3 in Las Vegas, Nevada.
What: IEEE Electronic Components Technology Conference Date:
May 31-June 3, 2016 Location: The Cosmopolitan of Las Vegas,
Las Vegas, Nevada Booth Number: 101 Registration
Information: Conference attendees can register for the show at http://ectc.net/. Details:
At the show, Invensas will showcase its Bond-Via-Array™ (BVA®) fine
pitch vertical interconnect technology for Package-on-Package (PoP) and
System-in-Package (SiP) applications plus ZiBond® homogeneous direct
bond and Direct Bond Interconnect (DBI®) hybrid bonding technologies for
wafer and die level 3D interconnect applications.
BVA is a fine pitch vertical interconnect technology that forms package
level 3D interconnects between active or passive devices utilizing the
existing wire bond infrastructure. This technology provides the industry
with unmatched tolerance to process variations, which translates into
improved yield and cost efficiencies. ZiBond is a low temperature
homogenous (oxide-to-oxide) direct bonding technology that forms strong
bonds between wafers or die with same or different coefficients of
thermal expansion (CTE), without the need for the application of
external pressure. DBI is a low temperature hybrid direct bonding
technology that allows wafers or die to be bonded with exceptionally
fine pitch 3D electrical interconnect at low cost-of-ownership.
For more information about BVA, ZiBond and DBI technologies, visit www.invensas.com.
About Tessera Technologies, Inc.
>
Tessera Technologies, Inc., including its Invensas and
FotoNation (News - Alert) subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.
Tessera, the Tessera logo, Invensas, the Invensas logo, Bond-Via-Array
and BVA, are trademarks or registered trademarks of affiliated companies
of Tessera Technologies, Inc. in the United States and other countries.
All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.
Safe Harbor Statement
This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
characteristics, benefits, and features of BVA and potential future uses
of such technology in future products. Material factors that may cause
results to differ from the statements made include the plans or
operations relating to the businesses of Tessera Technologies, Inc. (the
"Company"); market or industry conditions; changes in patent laws,
regulation or enforcement, or other factors that might affect the
Company's ability to protect or realize the value of its intellectual
property; the expiration of license agreements and the cessation of
related royalty income; the failure, inability or refusal of licensees
to pay royalties; initiation, delays, setbacks or losses relating to the
Company's intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; fluctuations in operating
results due to the timing of new license agreements and royalties, or
due to legal costs; the risk of a decline in demand for semiconductors
and products utilizing FotoNation technologies; failure by the industry
to use technologies covered by the Company's patents; the expiration of
the Company's patents; the Company's ability to successfully complete
and integrate acquisitions of businesses; the risk of loss of, or
decreases in production orders from, customers of acquired businesses;
financial and regulatory risks associated with the international nature
of the Company's businesses; failure of the Company's products to
achieve technological feasibility or profitability; failure to
successfully commercialize the Company's products; changes in demand for
the products of the Company's customers; limited opportunities to
license technologies due to high concentration in the markets for
semiconductors and related products and smartphone imaging; and the
impact of competing technologies on the demand for the Company's
technologies. You are cautioned not to place undue reliance on the
forward-looking statements, which speak only as of the date of this
release. The Company's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended Dec. 31, 2015 and its Quarterly Report on Form 10-Q for the
quarter ended Mar. 31, 2016, include more information about factors that
could affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release.
Although this release may remain available on the Company's website or
elsewhere, its continued availability does not indicate that the Company
is reaffirming or confirming any of the information contained herein.
TSRA-I
View source version on businesswire.com: http://www.businesswire.com/news/home/20160524005575/en/
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