[September 01, 2015] |
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Research and Markets: Flip Chip/WLP Manufacturing and Market Analysis Study 2015
Research and Markets (http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp)
has announced the addition of the "Flip
Chip/WLP Manufacturing and Market Analysis" report to their
offering.
Flip chips are appearing in a plethora of high-volume consumer products
such as mobile phones, digital cameras, MP3 players, and computer
peripherals. Wafer-level packaging (WLP), the fabrication of the package
directly on the wafer, is experiencing exceptional growth and stands out
as one of the bright growth areas in electronics today.
WLP offers lower cost, a smaller package, higher performance and added
functionality compared to older methods. In the world of
high-speed/high-performance IC and package design, flip chips are
appearing in a plthora of high-volume consumer products such as mobile
phones, digital cameras, MP3 players, and computing.
This report examines the market for flip chip ICs, and the lithography
and wet etch tools used in their manufacture.
Key Topics Covered:
Chapter 1 Introduction
Chapter 2 Executive Summary
Chapter 3 Flip Chip/WLP Issues and Trends
3.1 Introduction
3.2 Wafer Bumping
3.3 Wafer Level Packaging
3.4 Pad Redistribution
3.5 Wafer Bumping Costs
Chapter 4 Lithography Issues And Trends
4.1 Issues
4.2 Exposure Systems
4.3 Competitive Technologies
Chapter 5 UBM Etch Issues And Trends
5.1 Introduction
5.2 Technology Issues And Trends
5.3 Batch Versus Single-Wafer Etching
Chapter 6 Metallization Issues and Trends
6.1 Introduction
6.2 Sputtering Metallization
Chapter 7 Market Analysis
7.1 Market Drivers For Flip Chip And WLP
7.2 Market Opportunities
7.3 Challenges
7.4 Flip Chip Market
7.5 Lithography Market
7.6 Wet Etch Market
7.7 Deposition Market
For more information visit http://www.researchandmarkets.com/research/slmhpv/flip_chipwlp
View source version on businesswire.com: http://www.businesswire.com/news/home/20150901006559/en/
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