[June 29, 2015]

Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Zeta Instruments, Inc., announced today that a leading Taiwan based outsourced semiconductor assembly and test (OSAT) ordered its third Zeta-580™ automated metrology system for production monitoring of advanced semiconductor packaging, including 2.5D interconnect and fan-out wafer level packaging (FOWLP).

With its patented ZDot™ 3D optical profiling technology and multi-mode optics, the Zeta-580 Optical Profiler provides measurement capabilities not found in any other metrology system. In addition to its advanced features, it enables metrology tool consolidation, providing reduced cost-of-ownership for advanced processes.

"Mobile electronics such as smart phones continue to drive the production of more powerful semiconductors requiring advanced packaging techniques, including 2.5D interconnect and FOWLP," said a fab manager at the OSAT facility in Taiwan. "The Zeta-580 Optical Profiler is the only tool that is able to meet all of our metrology requirements. Also, its ability to perform multiple measurements on one system has enabled us to consolidate our metrology tool set to significantly reduce our cost-of-ownership."

About Zeta Instruments

Zeta Instruments designs and manufactures Multi-Mode optical profilers and defect inspection systems for multiple high-technology industries, including: advanced semiconductor packaging, high-brightness LEDs, advanced glass manufacturing, solar, microfluidics and data storage. In less than five years, Zeta Instruments has installed over 200 systems in 20 countries. The rapid adoption of Zeta's products is a testament to the company's well-differentiated and patented ZDot™ technology. Its locations include headquarters in San Jose, CA (News - Alert), a regional office in Shanghai, China, and sales and service representatives worldwide. For more on Zeta Instruments please visit www.zeta-inst.com

Z-Dot and the Zeta-580 are trademarks of Zeta Instruments, Inc.

View source version on businesswire.com: http://www.businesswire.com/news/home/20150629005299/en/

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