Inc., a provider of advanced wireless technologies and products for voice and data communications, recently demonstrated its integrated Slim Chip HSPA Modem at the Mobile World Congress (News
) 2009 in Barcelona.
The modem is compatible with a number of application processors. Interdigital conducted the demonstration on Texas Instrument’s
new OMAP 3 Mobile Development Platform (MDP) using the Android
“We are pleased to be the wireless modem supplier for TI’s advanced OMAP 3 platform. Our high performance HSPA modem offers instant mobile broadband connectivity, accelerating the development of compelling new applications,” said Mark Lemmon, executive vice president of Business Development for InterDigital.
) SlimChip MID (Mobile Internet Device) Module has a pre-integrated 3G modem option for the Zoom OMAP34x-II MDP, which delivers wireless connectivity in voice and data services. It has also been designed to enable mobile broadband performance for a variety of innovative mobile broadband devices such as Smartphones, notebook computers, Mobile Internet Devices (MIDs) and consumer electronics.
The SlimChip MID Module has also been pre-integrated with Texas Instrument’s (TI) evaluation platform. This application is based on the OMAP34x processors and is expected to improve customer evaluations and enhance product development.
These modules are independent “wireless engines” that are capable of handling a variety of application processors (APs), such as the recently announced second generation OMAP 4 from TI.
“TI is focused on advancing the mobile user experience, including support for advanced multimedia capabilities, as well as a variety of connectivity options, including 3.5G modem technology such as that offered by InterDigital
,” said Bill Crean, Strategic Marketing Manager, TI.
With a 3G modem option, InterDigital’s SlimChip MID Module has been pre-integrated with the Zoom OMAP34x-II MDP, enabling mobile application developers to use this platform.
The flexible build of the OMAP 3 platform enables it to easily work with InterDigital’s SlimChip MID Module. The collaboration of these technologies provides users with a tool to enhance innovation and enable creative application development.
Shireen Dee is a contributing editor for TMCnet. To read more of Shireen's articles, please visit her columnist page.
Edited by Tim Gray