RadiSys Corporation Collaborates with IFTEST

RadiSys (News - Alert) Corporation, a provider of application-ready software and hardware platforms for use in the communications, multi-media, defense and medical markets, has announced that IFTEST has joined the RadiSys Alliance Partner Program to provide customized COM Express carrier boards for the medical and industrial markets.

 

IFTEST provides custom carrier design services, including production, verification and testing whereas the RadiSys’ COM Express processor modules allow for breakthrough processing performance.

 

The collaboration between RadiSys and IFTEST will help the medical and industrial customers, tap into the combined expertise of two companies to leverage a customized carrier board that meets their application requirements. The requirements of the customers are met, without them having to devote precious resources to in–house development.

 

“In today’s competitive landscape, original equipment manufacturers do not have the time built into their aggressive time–to–market schedules to combine a processor module with a custom carrier board in–house,” Keate Despain (News - Alert), senior director, Commercial Business Unit, RadiSys, said. “IFTEST brings a deep understanding of the requirements of the medical and industrial markets to our already robust RAPP program, enabling us to save our customers months of design and development time by streamlining their development cycle.”

 

For IFTEST custom carrier boards, RadiSys’ COM Express solutions are the ideal processor module, offering a wide range of choice to meet a customer’s unique price and performance goals.

 

Apart from designing and integrating the RadiSys processing module onto custom carrier boards, IFTEST also has a deep understanding of the complex certification requirements of the medical and industrial markets.

 

“There are many complex facets in the design process of a customized carrier board for the medical and industrial markets,” Werner Kunz, Sales and Marketing at IFTEST, said. “RadiSys’ COM Express product line allows our customers to select the ideal processing module and carrier features for the unique size, temperature and power requirements of their customized application. Through a formal RAPP partnership, our customers benefit from a smooth development cycle, saving them from costly design turns that they would face in creating a production–level carrier board on their own.”