Divide to Conquer: Meeting the Needs of 3G Wireless with Multicore Technology

For most wireless operators, data traffic is rapidly growing – and not just because data applications such as e-mail, Web browsing and music downloads are wildly popular. Data traffic also is growing because of wider use of telemetry, telematics and other machine-to-machine (M2M) applications. In order to meet this growing demand, Alan Gatherer, Chief Technical Officer of Texas Instruments Communications Infrastructure Group and Markus Levy, President of the Multicore Association will discuss how multicore technology can help customers address 3G wireless needs.

By attending this webinar, you will gain a perspective from one of the leading developers of multicore technology on why today’s operators need next-generation infrastructure solutions with maximum flexibility and performance. Multicore platforms provide the computationally advanced capabilities that OEMs need to capitalize on these trends and applications across a vast network of communications segments. After the presentation, the Webinar will be open for a live Q&A. Be sure to have your questions ready!

Presenters:

Alan Gatherer

Chief Technical Officer, Communications Infrastructure Group
Texas Instruments

Alan Gatherer is the CTO for the Communications Infrastructure Group at Texas Instruments. He is responsible for all strategic development of TI’s digital baseband modems for 3G wireless infrastructure. Alan joined TI in 1993 and has worked on various digital modem technologies including cable modem, ADSL and 3G handset and basestation modems. He was elected to Senior Member of Technical Staff in 1996 and then to Distinguished Member of Technical Staff in 2000. Alan also served as the manager of the wireless cellular communications group in R&D. Alan has authored seven journal papers and 20 conference papers. In addition, he holds 33 awarded patents and is author of the book “The Application of Programmable DSPs in Mobile Communications.” Alan holds a bachelor of engineering in the area of microprocessor engineering from Strathclyde University in Scotland. He also attended Stanford University in California where he received a master’s in electrical engineering in 1989 and his doctorate in electrical engineering in 1993.

Markus Levy

President, Multicore Association

Markus is founder and president of EEMBC (www.eembc.org), developer of application-level benchmarks for embedded processors. Markus is also president of the Multicore Association (www.multicore-association.org), an organization developing industry-standard solutions for products that involve multicore implementations. In addition, Markus is chairman of the Multicore Expo conference series. Markus has more than nine years of experience working with EDN Magazine and Instat/MDR. Beginning in 1987, Markus worked for Intel Corporation as both a senior applications engineer and customer training specialist for Intel's microprocessor and flash memory products. While at Intel, Markus received several patents for his ideas related to flash memory architecture and usage as a disk drive alternative. Markus is also co-author of 'Designing with Flash Memory', the only technical book on this subject.

Register Now!