Telecom Platform Deployment Featured Article
NEI Addresses Computing Technology Challenges with Telecom Platform Deployment
By Michelle Amodio, TMCnet Contributor
Telecom platform deployment is very much a part of business computing; therefore, the range of any project must use an all-inclusive approach. The challenge lies in finding the right computer technology that will support the computing requirements of the application.
NEI (News - Alert) addresses this challenge, in addition to others with its LEAD (Lifecycle Engine for Application Deployment System), in getting applications to market. According to the company, it applies domain expertise and knowledge of ATCA, NEBS and DC powered servers to solve complex design, integration and deployment problems.
Within the industry, officials from other key players in the telecom space cite that challenges for service providers include the “contradiction between the demand for bandwidth and the willingness to pay for it,” according to Telco Systems. Open standards in software and hardware will allow providers to put their best forward when it comes to network offerings.
As telecom equipment managers (TEMs) face the complex nature of offering mixed technologies, both in cost and development, relying on a solution like NEI’s LEAD provides seamless delivery of any application to market.
Through solution design, system integration, application management and support, the system, as described by NEI officials, encompasses the entire lifecycle and is supported by what they describe as “a disciplined approach to program management.”
So, how is NEI contributing to telecom platform deployment?
According to NEI, “NEI redefines application deployment by applying our domain expertise and knowledge of ATCA, NEBS and DC powered servers to solve complex design, integration and deployment problems. These platforms offer a variety of expansion slots and I/O options required for installing high-end telephony boards, high-performance multi-core processors and high-reliability features such as RAID and redundant power. In addition, with several years experience developing ATCA systems and as an executive member of PICMG (News - Alert) 3 standards body, NEI has a thorough understanding of ATCA design and integration requirements, including power and thermal requirements for high-end communications blades.”
The LEAD system includes solution design, as well as system integration with full manufacturing and integration capabilities, including frame integration and thermal testing that are backed by robust process controls to ensure predictable repeatable results.
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Edited by Jamie Epstein