Telecom Platform Deployment Featured Article

Molex (News - Alert) specializes in interconnect solutions for several applications and industries including telecom platform deployment, consumer electronics, industrial, automotive, medical, military and lighting. 

The company recently showcased its interconnect solutions at Super Computing 2012. They include 25 Gbps QSFP+ Silicon Photonics Based Active Optical Cables; Quad Small Form-factor Pluggable (QSFP+) 40 Gbps QDR and 56 Gbps Active Optical Cable (AOC) Assemblies; z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect Solution; iPass (News - Alert)+ (HSC) CXP Copper and Optical Systems; and zSFP+ Connector Solutions.

The company also showcased its 100 Gbps QSFP+ Active Optical Cable based on silicon photonics single chip transceiver technology, which enables next-generation 100 Gbps optical interconnect applications.

The QSFP+ 40 Gbps QDR and 56 Gbps AOC Assemblies provide the longest link distance and lowest power consumption on the market today and they achieve 40 and 56 Gbps data rates over long reaches of up to four km (2.49 miles) using only 0.78 and one W per cable end. The cable provides the flexibility of traditional optical modules by interfacing with all major systems via a standard Multiple Source (News - Alert) Agreement QSFP connector.

Additionally, the zQSFP+ interconnect solution is designed for next-generation high-density applications found in high performance computing, telecommunications, data networking, test and measurement and medical diagnostic equipment. And the iPass+ (HSC) CXP Copper and Optical Systems enables twelve channels of 10 Gbps data for up to 120 Gbps of total bandwidth, with the enhanced footprint integrated connectors enabling ten channels of 10 Gbps data for up to 100 Gbps of total bandwidth.

zSFP+ Connector Solutions supports 25 Gbps applications, with backward compatibility for 10 Gbps Ethernet and 16 Gbps Fibre Channel applications.

In addition to these connector solutions, Molex also demonstrated its zQSFP+ stacked thermal management technologies.  Wind tunnel testing has been found to offer the most accurate, repeatable test method. Thus, data generated via this offering will support the design of NEBS-rated applications with current and next-generation pluggable I/O modules.

Want to learn more about the latest in communications and technology? Then be sure to attend ITEXPO Miami 2013, Jan 29- Feb. 1 in Miami, Florida.  Stay in touch with everything happening at ITEXPO (News - Alert). Follow us on Twitter.