Telecom Platform Deployment Featured Article

Telcordia (News - Alert) Technologies officials say the company is pursuing a strong focus in their consulting services to support Service Providers on “different aspects of network equipment physical protection and compatibility.”

This may primarily be focused on Network Equipment Building Standards (NEBS) requirements related to fire, earthquake, shock, vibration, airborne contaminants, EMC (News - Alert) issues and adverse temperature and humidity conditions, company officials say, adding that it “can also be focused on customized Service Provider requirements.”

In fact, according to the company’s mission and NEBS focus, services may include response to emergencies to address field failures, to assist the Service Provider in resolving equipment supplier concerns, or on a sustained consultation basis.

Consultation, product testing and design reviews to help determine the environmental compatibility of equipment being considered for network deployment are offered, as is direct interaction with suppliers on behalf of the Service Provider, on-site physical protection assessment of Service Provider's central offices and other facilities and training of Service Provider personnel on the technical aspects and importance of NEBS requirements.

Recently TMC’s Jamie Epstein wrote that in order to receive NEBS compliance, the process must begin in the initial design phase of a product. Product requirement documents are looked at to make sure the given product has been created to meet the pre-defined requirements, and that full test coverage is applied.

Detailed design reviews including both the electrical and mechanical parts of each system element, take place early in the product program definition.

 A white paper released by Emerson (News - Alert), titled “Successful Design and Test Methodology for NEBS- Creating Equipment that Meets Carrier Requirements using Open Standards,” represents the fact that proven design guidelines and measured care are crucial in several areas including PCB layout, product enclosure shielding effectiveness, I/O filtering, surge suppression, bonding and grounding, thermal performance and mechanical structural integrity, Epstein wrote.