Optical component manufacturers LAPIS Semiconductor Co. Ltd., Mitsubishi (News - Alert) Electric Corporation, Oclaro, Inc., Renesas Electronics Corporation and Sumitomo Electric Industries, Ltd., released multisource agreement specifications for 40 Gbit/s serial solutions based on XLMD2-MSA miniature optical device for pluggable transceivers
In today's 300-pin MSA and CFP transceiver module market, XLMD-MSA TOSAs and ROSAs are widely adopted. With the introduction of the CFP2/4 MSA, thin, miniature TOSAs and ROSAs are essential for downsizing the pluggable transceiver modules.
XLMD Multisource Agreement (MSA) was formed in March, 2007 to establish compatible sources of 40Gbit/s Transmitter Optical Sub-Assembly and Receiver Optical Sub-Assembly for use in the 40 Gbit/s transceivers. The XLMD MSA committee first published documents in Feb. 2008. This initiative standardizes the common mechanical dimensions, footprint and pin functions of the TOSA/ROSA devices.
The XMD MSA compliant TOSA/ROSA is widely accepted in the market. Followed by this, in July 2011, the XLMD2-MSA was formed to establish compatible sources of 40 Gbit/s miniature optical transmitter and receiver devices embedded into the compact 40 Gbit/s serial pluggable optical transceiver modules.
The XLMD2-MSA aims to establish compatible sources of 40 Gbit/s miniature optical transmitter and receiver devices embedded into the compact 40 Gbit/s serial pluggable optical transceiver modules. Companies adopting the XLMD2-MSA will promote MSA-compliant products in order to meet customer demand and expand the market.
The XLMD2-MSA specifications include mechanical dimensions, interfaces with a common printed circuit board (PCB) design, pin assignment and electrical characteristics for compatible optical devices including Cooled EMwL TOSA with built-in driver IC, Cooled EMwL TOSA, Cooled DML TOSA, Uncooled DML TOSA and PIN-TIA (News - Alert) ROSA.
Back in 2011, top optical chip and module manufacturers announced a transmitter optical sub-assembly and receiver optical sub-assembly multisource agreement for 40 Gbps pluggable transceiver modules. This initiative was established to meet increased demand for pluggable 40 Gbps serial modules.
Edited by Rachel Ramsey