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RadiSys A Platinum Sponsor At The Intel Embedded eVent

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TMCnews Featured Article


May 06, 2009

RadiSys A Platinum Sponsor At The Intel Embedded eVent

By Tim Gray, TMCnet Web Editor


Advanced embedded solutions provider RadiSys (News - Alert) is participating in the Intel Embedded eVent next week as Platinum Sponsor, showcasing  its roster of RadiSys solutions in Industrial Automation, Medical and AdvancedTCA (News - Alert).

 
In addition, the Oregon-based company will display content including videos, White Papers and collateral highlighting RadiSys solutions during the day long virtual tradeshow.
 
As the economy continues to stumble on its path toward recovery, innovative ideas of the recent past are helping ease financial burdens of the present. One idea that is quickly gaining momentum is the Virtual Tradeshow, and it has made impressive inroads in developing a forum to bring disparate yet like minded groups together without restrictions of space and travel costs.
 
In fact, as TMCnet recently reported, RadiSys, a major provider of advanced embedded solutions for the communications networking and commercial systems markets for OEMs, systems integrators, and solution providers, last year hosted its own online event with the ATCA Worldwide Virtual Tradeshow. The show was designed with a line-up of industry insiders including leading experts from all levels of the ATCA industry. 
 
The event featured topics such as: How soon will the industry move from 10 to 40G and What role is the CP-TA playing in translating the standard into market adoption?
 
It also covered Open Source; middleware solutions available to increase reliability and high availability on ATCA systems; and equipment manufacturer’s efforts to buy a carrier-grade off-the-shelf solution for their applications.
 
In recent years RadiSys has garnered industry accolades for its AdvancedTCA  (ATCA) form factor computing platforms used in network applications. Many telecom equipment vendors and systems integrators are making the move toward products using ATCA.
 
That is because many telecom equipment vendors and systems integrators have turned to products made using Advanced Telecommunications Computer Architecture (ATCA). The technology is the successor to CompactPCI (News - Alert) form factor, and is used for the creation of communications system components that can be reused for a variety of applications.
 
And AdvancedTCA is expected to be a big topic at Intel’s (News - Alert) online tradeshow slated for May 12 from 6am to 8pm PT.
 
In launching the first ever Intel online tradeshow, the company says the reasoning is simple: “The networked world is growing at a tremendous pace. In just six years, it's expected that 15 Billion intelligent devices will be connected to the Internet.”
 
Keynote speakers include: Doug Davis, vice president of the Digital Enterprise Group and general manager of the Embedded and Communications Group; Pranav Mehta, senior principal engineer and chief technology officer of Intel’s Embedded and Communications Group; and Richard Nass, director of Media/Content, TechInsights.

In addition, you'll have:
  • Simple, one-click access to industry-leading speakers & technologies
  • The freedom to view the information you want on your own schedule
  • Downloadable information you can save and review at your convenience
  • No travel expenses or lost productivity
For more information, please visit the Intel Web site here.

Tim Gray is a Web Editor for TMCnet, covering news in the IP communications, call center and customer relationship management industries. To read more of Tim’s articles, please visit his columnist page.

Edited by Tim Gray







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